Mendeleev Commun., 2016, 26, 527–529
After two days the reaction mixture was heated up to 200°C and
then isothermal study was held at a given temperature.After 120 min
the viscosity of the reaction mixture started to rise and after 140 min
Si–C and sterically hindered Ph–O–Ph bonds. At the tempera-
tures >640°C, fast oxidation of the polymer occurred. A sharp
weight loss of up to 21.8% at 1000°C is in good agreement with
,
,
we believe, polymer was gelled so that further viscosity measure-
ment was impossible. Thus, there is 2 h period for degassing sample
at reduced pressure and filling tool before the sample starts cure.
The monomer containing Si–O–Si-bridge demonstrated excel-
lent rheological properties, namely, a wide processing window
with low viscosities in the temperature range of 80–220°C and had
an increased lifetime at processing temperatures. This makes it
perfectly suitable for composite manufacturing by the RTM and
VIM methods.
theoretical amount of SiO (21.1%) which should be formed
after complete oxidation of the matrix.
In conclusion, a new low-melting highly hydrolytically stable
silicon-containing phthalonitrile monomer was prepared. The
pure monomer demonstrates excellent rheological properties
2
due to very low for phthalonitriles T = 4°C and could be used
g
for FRP production by RTM or VIM techniques. The study of the
curing process in the presence of 4 wt% of APB by rheometric
analysis showed that the considered thermosetting resin possessed
excessively long pot-life at 120°C and at 200°C gel time was
~2 h. These facts are very promising for high temperature poly-
mer matrix for composite applications. The flexible disiloxane
linkage enhances processability without compromising thermal
and oxidative stability. The cured resin possesses high heat deflec-
tion temperature Thd of 471°C. In argon atmosphere 5% weight
loss of the cured polymer occurs at 503°C, and with 76% residual
mass at 900°C.
Phthalonitrile curing occurs in the presence of amines or
phenols as initiators to yield 3D-network consisting of isoindoline,
triazine and phthalocyanine structures.2 Monomer curing was
performed by heating at 200°C for 24 h followed by slow heating
6,27
–
1
‡
(
2 K h ) up to 375°C with 8 h hold at final temperature. Such
slow program was applied to keep the external temperature lower
than current T of the sample, which is necessary to lower shrinkage
g
and solid samples formation. Due to the presence of highly flexible
Si–O–Si-bridges in the polymer matrix one could expect lowering
of heat deflection temperature of the cured samples. However,
The work was supported by the Russian Federation Ministry
of Education and Science within the contract no. 02.G25.31.0114.
the resulting cured resin demonstrated excellent value of Thd
=
=
471°C featured to phthalonitrile resins, which is higher than
those for reported phthalonitriles (Table 1). This can be explained
by different measurement method, namely TMA in penetration
mode, which usually gives uprated values.
Online Supplementary Materials
Supplementary data associated with this article can be found
in the online version at doi:10.1016/j.mencom.2016.11.023.
Thermal stability of the obtained polymer, evaluated by TGA
in air and argon atmosphere, are at the same high level as those of
reported phthalonitriles. According to TGA curves (Figure 2) and
the data in Table 1, in an inert atmosphere the polymer possessed
high thermal stability (curve 1) and did not loose weight up to
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Figure 2 TGA thermogram of the cured resin 5 in Ar and air.
‡
For more detail, see Online Supplementary Materials.
Received: 5th July 2016; Com. 16/4983
529 –
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