Chemical Property of Copper silicide (Cu5Si)
Chemical Property:
- Vapor Pressure:54300mmHg at 25°C
- Melting Point:825 °C
- PSA：0.00000
- Density:7.7-7.8 g/cm3
- LogP:-0.39330
- Water Solubility.:Insoluble in water.
- Hydrogen Bond Donor Count:0
- Hydrogen Bond Acceptor Count:0
- Rotatable Bond Count:0
- Exact Mass:344.62310
- Heavy Atom Count:6
- Complexity:0
- Purity/Quality:
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99.50% *data from raw suppliers
Copper silicide, 99.5% (metals basis) *data from reagent suppliers
Safty Information:
- Pictogram(s):
- Hazard Codes:
- MSDS Files:
-
SDS file from LookChem
Useful:
- Canonical SMILES:[Si].[Cu].[Cu].[Cu].[Cu].[Cu]
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Uses
Copper silicide?thin film?is used for?passivation?of?copper-based chips, where it serves to suppress?diffusion?and?electromigration?and serves as a?diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.
