Multi-step reaction with 10 steps
1.1: CuI / tetrahydrofuran; diethyl ether / 0.5 h / -15 - 0 °C
1.2: 92 percent / Me3SiCl / tetrahydrofuran; diethyl ether / 3 h / -78 °C
2.1: KHMDS / tetrahydrofuran; toluene / 0.5 h / -78 °C
2.2: 91 percent / Davis oxaziridine / tetrahydrofuran; toluene / 3 h / -78 °C
3.1: 92 percent / diisopropylethylamine; DMAP / CH2Cl2 / 48 h / 0 - 20 °C
4.1: 97 percent / DIBAL-H / tetrahydrofuran; toluene / 1.5 h / -78 - 0 °C
5.1: oxalyl chloride; DMSO; triethylamin / CH2Cl2 / 0.83 h / -55 - -30 °C
6.1: 8.5 g / CH2Cl2 / 14 h / 20 °C
7.1: CuI / tetrahydrofuran; diethyl ether / 0.5 h / -15 - 0 °C
7.2: 85 percent / Me3SiCl / tetrahydrofuran; diethyl ether / 3 h / -78 °C
8.1: KHMDS / tetrahydrofuran; toluene / 0.5 h / -78 °C
8.2: 80 percent / Davis oxaziridine reagent / tetrahydrofuran; toluene / 3 h / -78 °C
9.1: 82 percent / NaBH4 / tetrahydrofuran; H2O / 72 h / 20 °C
10.1: 60 percent / CH2Cl2 / 7 h / Heating
With
dmap; sodium tetrahydroborate; copper(l) iodide; oxalyl dichloride; potassium hexamethylsilazane; diisobutylaluminium hydride; dimethyl sulfoxide; triethylamine; N-ethyl-N,N-diisopropylamine;
In
tetrahydrofuran; diethyl ether; dichloromethane; water; toluene;
1.1: complexation / 1.2: Addition / 2.1: Metallation / 2.2: Oxidation / 3.1: Etherification / 4.1: Reduction / 5.1: Swern oxidation / 6.1: Wittig reaction / 7.1: complexation / 7.2: Addition / 8.1: Metallation / 8.2: Oxidation / 9.1: Reduction / 10.1: Etherification;
DOI:10.1021/ja970251g