Multi-step reaction with 11 steps
1: Et3N, AgNO3 / dimethylformamide
2: LiAlH4 / CH2Cl2 / 0 °C
3: i-Pr2NEt / CH2Cl2 / 0 °C
4: 1.) O3, 2.) Ph3P / 1.) CH2Cl2, -78 deg C, 2.) CH2Cl2
5: 1.) NaN(TMS)2, TMSCl, 2.) Pd(OAc)2 / 1.) THF, -15 deg C, 2.) MeCN, 22 deg C
6: 92 percent / n-BuLi, CuBr*DMS / tetrahydrofuran / -78 °C
7: 88 percent / NBS / tetrahydrofuran / 0 - 22 °C
8: 88 percent / DIBAL / CH2Cl2 / -78 °C
9: 85 percent / Imd2C=S, DMAP / various solvent(s) / 22 - 180 °C
10: 99 percent / TsNHNH2, NaOAc / tetrahydrofuran; H2O / 75 °C
11: 92 percent / Zn, EtOH, NH4Cl / Heating
With
dmap; palladium diacetate; N-Bromosuccinimide; lithium aluminium tetrahydride; n-butyllithium; chloro-trimethyl-silane; copper(I) bromide dimethylsulfide complex; ethanol; sodium acetate; sodium hexamethyldisilazane; diisobutylaluminium hydride; ammonium chloride; ozone; silver nitrate; triethylamine; N-ethyl-N,N-diisopropylamine; 1,1'-Thiocarbonyldiimidazole; toluene-4-sulfonic acid hydrazide; triphenylphosphine; zinc;
In
tetrahydrofuran; dichloromethane; water; N,N-dimethyl-formamide;
DOI:10.1021/ja00077a097