102653-80-5

Upstream product

• 1667-01-2 2,4,6-Trimethylacetophenone 
• 499-06-9 3,5-dimethylbenzoic acid 
• 201230-82-2 carbon monoxide 
• 861590-11-6 2-(2-ethyl-butyryl)-3,5-dimethyl-benzoic acid 
• 7697-37-2 nitric acid 
• 1731-26-6 1,3,5-trimethyl-2,4-cyclohexadiene 
• 762-42-5 dimethyl acetylenedicarboxylate 

Downstream Products

• 60398-94-9 3,5-dimethyl-phthalic acid anhydride 

Relevant academic research and scientific papers

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Synthesis of 1,2- and 1,3-dicarboxylic acids via Pd(II)-catalyzed carboxylation of aryl and vinyl C-H bonds

A Pd(II)-catalyzed reaction protocol for the direct carboxylation of benzoic and phenylacetic acid derivatives to form dicarboxylic acids has been developed. The reaction conditions are also applicable for the carboxylation of vinyl C-H bonds. The first C-H insertion Pd-aryl complex from carboxylic acids has been characterized by X-ray crystallography. Copyright