1131007-94-7 Usage
Uses
1. Used in Electronics Industry:
FATPA is used as a semiconductor material for its excellent thermal and morphological stability, making it suitable for applications in electronic devices that require high-temperature performance and structural integrity.
2. Used in Organic Light-Emitting Diodes (OLEDs):
FATPA is used as a material in the development of OLEDs due to its planar structure and stability. Its properties contribute to improved device performance, such as enhanced brightness, color quality, and energy efficiency.
3. Used in Photovoltaic Cells:
FATPA is utilized as a component in the manufacturing of photovoltaic cells, taking advantage of its stability and planar structure to improve the efficiency and durability of solar panels.
4. Used in Plastics and Polymers:
FATPA is employed as an additive in the plastics and polymers industry to enhance the thermal and morphological stability of the materials, resulting in improved mechanical properties and resistance to high temperatures.
5. Used in Chemical Sensors:
FATPA is used in the development of chemical sensors due to its planar structure and stability, which can facilitate the detection of specific chemical compounds with high sensitivity and selectivity.
Check Digit Verification of cas no
The CAS Registry Mumber 1131007-94-7 includes 10 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 7 digits, 1,1,3,1,0,0 and 7 respectively; the second part has 2 digits, 9 and 4 respectively.
Calculate Digit Verification of CAS Registry Number 1131007-94:
(9*1)+(8*1)+(7*3)+(6*1)+(5*0)+(4*0)+(3*7)+(2*9)+(1*4)=87
87 % 10 = 7
So 1131007-94-7 is a valid CAS Registry Number.
1131007-94-7Relevant academic research and scientific papers
Jiang, Zuoquan,Chen, Yonghua,Yang, Chuluo,Cao, Yue,Tao, Youtian,Qin, Jingui,Ma, Dongge
, p. 1503 - 1506 (2009)
A fully diarylmethylene-bridged triphenylamine derivative is efficiently synthesized. It has an almost planar triphenylamine (TPA) skeleton and exhibits excellent thermal and morphological stability. Devices with the novel TPA derivative as host material