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  • 1134517-50-2 Structure
  • Basic information

    1. Product Name: [ClCu(CNPh)2]2
    2. Synonyms: [ClCu(CNPh)2]2
    3. CAS NO:1134517-50-2
    4. Molecular Formula:
    5. Molecular Weight: 610.492
    6. EINECS: N/A
    7. Product Categories: N/A
    8. Mol File: 1134517-50-2.mol
  • Chemical Properties

    1. Melting Point: N/A
    2. Boiling Point: N/A
    3. Flash Point: N/A
    4. Appearance: N/A
    5. Density: N/A
    6. Refractive Index: N/A
    7. Storage Temp.: N/A
    8. Solubility: N/A
    9. CAS DataBase Reference: [ClCu(CNPh)2]2(CAS DataBase Reference)
    10. NIST Chemistry Reference: [ClCu(CNPh)2]2(1134517-50-2)
    11. EPA Substance Registry System: [ClCu(CNPh)2]2(1134517-50-2)
  • Safety Data

    1. Hazard Codes: N/A
    2. Statements: N/A
    3. Safety Statements: N/A
    4. WGK Germany:
    5. RTECS:
    6. HazardClass: N/A
    7. PackingGroup: N/A
    8. Hazardous Substances Data: 1134517-50-2(Hazardous Substances Data)

1134517-50-2 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 1134517-50-2 includes 10 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 7 digits, 1,1,3,4,5,1 and 7 respectively; the second part has 2 digits, 5 and 0 respectively.
Calculate Digit Verification of CAS Registry Number 1134517-50:
(9*1)+(8*1)+(7*3)+(6*4)+(5*5)+(4*1)+(3*7)+(2*5)+(1*0)=122
122 % 10 = 2
So 1134517-50-2 is a valid CAS Registry Number.

1134517-50-2Upstream product

1134517-50-2Relevant articles and documents

Tailoring Precursors for Deposition: Synthesis, Structure, and Thermal Studies of Cyclopentadienylcopper(I) Isocyanide Complexes

Willcocks,Pugh,Cosham,Hamilton,Sung,Heil,Chalker,Williams,Kociok-K?hn,Johnson

, p. 4869 - 4881 (2015)

We report here the synthesis and characterization of a family of copper(I) metal precursors based around cyclopentadienyl and isocyanide ligands. The molecular structures of several cyclopentadienylcopper(I) isocyanide complexes have been unambiguously determined by single-crystal X-ray diffraction analysis. Thermogravimetric analysis of the complexes highlighted the isopropyl isocyanide complex [(η5-C5H5)Cu(CNiPr)] (2a) and the tert-butyl isocyanide complex [(η5-C5H5)Cu(CNtBu)] (2b) as possible copper metal chemical vapor deposition (CVD) precursors. Further modification of the precursors with variation of the substituents on the cyclopentadienyl ligand system (varying between H, Me, Et, and iPr) has allowed the affect that these changes would have on features such as stability, volatility, and decomposition to be investigated. As part of this study, the vapor pressures of the complexes 2b, [(η5-MeC5H4)Cu(CNtBu)] (3b), [(η5-EtC5H4)Cu(CNtBu)] (4b), and [(η5-iPrC5H4)Cu(CNtBu)] (5b) over a 40-65 °C temperature range have been determined. Low-pressure chemical vapor deposition (LP-CVD) was employed using precursors 2a and 2b to synthesize thin films of metallic copper on silicon, gold, and platinum substrates under a H2 atmosphere. Analysis of the thin films deposited onto both silicon and gold substrates at substrate temperatures of 180 and 300 °C by scanning electron microscopy and atomic force microscopy reveals temperature-dependent growth features: Films grown at 300 °C are continuous and pinhole-free, whereas films grown at 180 °C consist of highly crystalline nanoparticles. In contrast, deposition onto platinum substrates at 180 °C shows a high degree of surface coverage with the formation of high-density, continuous, and pinhole-free thin films. Powder X-ray diffraction and X-ray photoelectron spectroscopy (XPS) both show the films to be high-purity metallic copper.

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