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4-[1',2',3',4',4'a,9'a-hexahydro-6'-hydroxyspiro(cyclohexane-1,9'-xanthene)-4'a-yl]resorcinol is a chemical with a specific purpose. Lookchem provides you with multiple data and supplier information of this chemical.

138446-23-8

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138446-23-8 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 138446-23-8 includes 9 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 6 digits, 1,3,8,4,4 and 6 respectively; the second part has 2 digits, 2 and 3 respectively.
Calculate Digit Verification of CAS Registry Number 138446-23:
(8*1)+(7*3)+(6*8)+(5*4)+(4*4)+(3*6)+(2*2)+(1*3)=138
138 % 10 = 8
So 138446-23-8 is a valid CAS Registry Number.

138446-23-8Downstream Products

138446-23-8Relevant academic research and scientific papers

NOVEL SUBSTITUTED FLAVAN DERIVATIVES AND PROCESS FOR THE PREPARATION THEREOF

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Page/Page column 22, (2022/01/04)

The present invention relates to novel substituted flavan derivatives of the Formula (I). The present invention also relates to a process for the preparation of phthalonitrile or cyanate ester flavan derivatives. The present invention also relates to use

Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition

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, (2008/06/13)

An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: with a carbonyl compound represented by the general formula: which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.

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