14396-21-5

Basic information

• Product Name: 1,3-dimethyldisiloxane
• Synonyms: 1,3-dimethyldisiloxane;1,3-Dimethylpropanedisiloxane;Einecs 238-361-3
• CAS NO: 14396-21-5
• Molecular Formula: C₂H₁₀OSi₂
• Molecular Weight: 106.2712
• EINECS: 238-361-3
• Mol File: 14396-21-5.mol
• Article Data: 4

Chemical Properties

• Melting Point: -138 °C
• Boiling Point: 34.7°Cat760mmHg
• Flash Point: °C
• Appearance: /
• Density: g/cm³
• Vapor Pressure: 536mmHg at 25°C
• CAS DataBase Reference: 1,3-dimethyldisiloxane(CAS DataBase Reference)
• NIST Chemistry Reference: 1,3-dimethyldisiloxane(14396-21-5)
• EPA Substance Registry System: 1,3-dimethyldisiloxane(14396-21-5)

Safety Data

• Hazardous Substances Data: 14396-21-5(Hazardous Substances Data)

Usage

General Description

1,3-dimethyldisiloxane is a clear, colorless liquid with a chemical formula of C4H14OSi2. It is a organosilicon compound with a silicone backbone and two methyl groups attached to the silicon atoms. This chemical is commonly used as a building block in the production of silicone polymers and resins. It is also utilized as a coating agent and release agent in various manufacturing processes, as well as a crosslinking agent in the production of silicon-based materials. 1,3-dimethyldisiloxane is considered to be relatively low in toxicity and has a low environmental impact, making it a versatile and widely used chemical in various industrial applications.

InChI:InChI=1/C2H6OSi2/c1-4-3-5-2/h1-2H3

Upstream product

• 992-94-9 methylsilane 
• 993-00-0 chloro-methyl-silane 
• 18089-64-0 methyl iodosilane 

Downstream Products

• 993-00-0 chloro-methyl-silane 

Relevant articles and documents

Reaction of Hydrogen Peroxide with Organosilanes under Chemical Vapour Deposition Conditions

When a stream of vapour at low pressure which contained a mixture of H2O2 with an organosilane, RSiH3 (R = alkyl or alkenyl), impinged on a silicon wafer, deposition of oxide films of nominal composition RxSiO(2-0.5x), where x 3 or higher alkenyl groups. or higher alkenylgroups. Possible mechanism for the Si-C bond cleavage reaction are discussed, with energetic rearrangement of radical intermediates of type Si(H)(R)(OOH)' being favoured.

Determination of the Molecular Structures of Bis(methylsilyl) Ether and Bis(dimethylsilyl) Ether in the Gas Phase by Electron Diffraction

The molecular structures of the title compounds, O(SiH2Me)2 and O(SiHMe2)2, in the gas phase, have been determined by electron diffraction.The monomethylsilyl ether has at least two conformers, the major one (64percent) having the methyl groups twisted by 124(4) and 58(8) deg away from the positions in which the Si-C bonds are trans to O-Si bonds.Other important parameters (ra) are: r(Si-C) 186.4(3), r(Si-O) 164.2(3) pm; SiOSi 143.0(6) and OSiC 109.7(5) deg.In the dimethylsilyl ether the silyl groups are twisted by 101(8) and 41(4) deg away from the symmetrical position in which both Si-H bonds are cis to O-Si bonds, so that the dimethylsilyl groups are staggered with respect to each other.Principal parameters (ra) are: r(Si-C) 186.4(3), r(Si-O) 163.5(2) pm; SiOSi 148.4(9), OSiC 110.1(6), and CSiC 107.4(17) deg.