181186-29-8

Basic information

• Product Name: POLY(PHENYL-METHYLSILSESQUIOXANE)
• Synonyms: POLY(PHENYL-METHYLSILSESQUIOXANE);HardSil (TM) AP Abrasion Resistant Coating (Phenyl-methylsilsesquioxane resin 15-25% in xylene;Polyphenylmethylsilesquioxanephenylmethyl;poly(Phenyl-methylsilsesquioxane)90%phenyl,10%methyl;POLY(PHENYL-METHYLSILSESQUIOXANE) PHENYL, 10% METHYL;Silsesquioxanes, me ph, hydroxy-terminated
• CAS NO: 181186-29-8
• Molecular Weight: 0
• Mol File: 181186-29-8.mol
• Article Data: 0

Chemical Properties

• Boiling Point: 137°C
• Flash Point: 32°C
• Appearance: /
• Density: 0,92 g/cm3
• Refractive Index: 1.55
• CAS DataBase Reference: POLY(PHENYL-METHYLSILSESQUIOXANE)(CAS DataBase Reference)
• NIST Chemistry Reference: POLY(PHENYL-METHYLSILSESQUIOXANE)(181186-29-8)
• EPA Substance Registry System: POLY(PHENYL-METHYLSILSESQUIOXANE)(181186-29-8)

Safety Data

• Statements: 36/37/38
• Safety Statements: 26-36/37/39
• RIDADR: 1993
• TSCA: No
• Hazardous Substances Data: 181186-29-8(Hazardous Substances Data)

Usage

Description

POLY(PHENYL-METHYLSILSESQUIOXANE) is a unique chemical compound belonging to the silsesquioxane family, characterized by a three-dimensional network of phenyl-methylsilsesquioxane units. These units are commonly used as precursors for the preparation of various hybrid organic-inorganic materials. POLY(PHENYL-METHYLSILSESQUIOXANE) is known for its excellent thermal and chemical stability, making it suitable for a wide range of applications.
Used in Coatings Industry:
POLY(PHENYL-METHYLSILSESQUIOXANE) is used as a coating material for its excellent thermal and chemical stability, as well as its enhanced mechanical properties and resistance to degradation.
Used in Adhesives Industry:
In the adhesives industry, POLY(PHENYL-METHYLSILSESQUIOXANE) serves as an adhesive component due to its strong bonding capabilities and stability under various conditions.
Used in Electronic Materials Industry:
POLY(PHENYL-METHYLSILSESQUIOXANE) is utilized as a component in electronic materials because of its thermal and chemical stability, which is crucial for the performance and longevity of electronic devices.