18715-54-3 Usage
Chemical compound
1,4-BIS(2,3-EPOXYPROPYLOXYPROPYL-DIMETHYLSILYL)BENZENE is a chemical compound commonly used as a crosslinking agent in the production of epoxy resins.
Physical state
It is a colorless to pale yellow liquid.
Heat and chemical resistance
It is highly resistant to heat and chemicals, making it a valuable component in industrial applications.
Industrial applications
It is used in adhesives, coatings, and composites.
Property improvement
It is known for its ability to improve the mechanical, thermal, and chemical resistance properties of epoxy-based materials, making them more durable and long-lasting.
Safety precautions
It can be harmful if ingested, inhaled, or comes into contact with the skin, and should only be used in well-ventilated areas with proper protective equipment.
Check Digit Verification of cas no
The CAS Registry Mumber 18715-54-3 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 1,8,7,1 and 5 respectively; the second part has 2 digits, 5 and 4 respectively.
Calculate Digit Verification of CAS Registry Number 18715-54:
(7*1)+(6*8)+(5*7)+(4*1)+(3*5)+(2*5)+(1*4)=123
123 % 10 = 3
So 18715-54-3 is a valid CAS Registry Number.
InChI:InChI=1/C22H38O4Si2/c1-27(2,13-5-11-23-15-19-17-25-19)21-7-9-22(10-8-21)28(3,4)14-6-12-24-16-20-18-26-20/h7-10,19-20H,5-6,11-18H2,1-4H3
18715-54-3Relevant articles and documents
Syntheses and polymerization of epoxy monomers consisting of carbosilane segments and properties of the networked polymers
Karimata, Ayumu,Matsumoto, Kozo,Endo, Takeshi
, p. 140 - 145 (2016)
Two diglycidyl ethers which consist of a flexible carbosilane segments and of rigid phenylene moieties (1 and 2) were synthesized and investigated in order to evaluate their heat-curing behavior (epoxy homopolymerization) as well as thermal and mechanical properties of the networked polymers. Differential scanning calorimetry (DSC) analysis revealed that melting points of both diepoxides were??73.9 and??50.7?°C, respectively. Networked polymers of 1 and 2 showed glass transition temperature (Tg)s below ambient temperature of 2.2 and 18.7?°C, respectively. High thermal stability of cured 1 and 2 were confirmed by thermogravimetric analysis (TGA) (5% weight loss temperature (Td5)?=?369?°C for 1 and 351?°C for 2). Tensile tests of cured 1 and 2 clarified that their Young's moduli were (9.76?±?0.135)?2 and (1.29?±?0.114) ?1?MPa, respectively.
