227754-04-3

Basic information

• Product Name: 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane
• CAS NO: 227754-04-3
• Molecular Formula: C₁₈H₄₆O₅Si₄
• Molecular Weight: 454.9
• Mol File: 227754-04-3.mol
• Article Data: 0

Chemical Properties

• Boiling Point: 382.4°C at 760 mmHg
• Flash Point: 166.3°C
• Density: 0.909g/cm³
• Vapor Pressure: 1.04E-05mmHg at 25°C
• Refractive Index: 1.429
• CAS DataBase Reference: 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane(CAS DataBase Reference)
• NIST Chemistry Reference: 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane(227754-04-3)
• EPA Substance Registry System: 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane(227754-04-3)

Safety Data

• Hazardous Substances Data: 227754-04-3(Hazardous Substances Data)

Usage

General Description

2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane is a chemical compound that contains multiple silicon and oxygen atoms in its structure. It is used as a silane coupling agent, which is a type of adhesion promoter that is commonly used in the production of composite materials and in the treatment of surfaces to improve adhesion between different materials. 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethyl-silyl]oxy-dimethyl-silane is particularly effective for bonding organic materials to inorganic materials, and it is also used in the production of silicone polymers and resins. Additionally, it is used as a precursor in the synthesis of other organosilicon compounds and as a cross-linking agent in the production of elastomers and sealants. Overall, it plays an important role in various industrial processes and applications related to materials science and chemistry.