24535-13-5 Usage
Uses
Used in Pharmaceutical Industry:
3-(2-hydroxyphenyl)propanohydrazide is used as a monoamine oxidase inhibitor (MAOI) for its antidepressant properties, increasing the levels of neurotransmitters in the brain to alleviate symptoms of depression.
3-(2-hydroxyphenyl)propanohydrazide is also used as an anti-tuberculosis agent, contributing to the treatment of tuberculosis by targeting the causative bacteria.
Used in Neuroprotective and Anti-inflammatory Research:
3-(2-hydroxyphenyl)propanohydrazide is used as a potential neuroprotective agent for its ability to protect neurons from damage, which could be beneficial in the treatment of neurodegenerative diseases.
3-(2-hydroxyphenyl)propanohydrazide is used as a potential anti-inflammatory agent due to its capacity to reduce inflammation, which may be useful in managing inflammatory conditions.
Check Digit Verification of cas no
The CAS Registry Mumber 24535-13-5 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,4,5,3 and 5 respectively; the second part has 2 digits, 1 and 3 respectively.
Calculate Digit Verification of CAS Registry Number 24535-13:
(7*2)+(6*4)+(5*5)+(4*3)+(3*5)+(2*1)+(1*3)=95
95 % 10 = 5
So 24535-13-5 is a valid CAS Registry Number.
InChI:InChI=1/C9H12N2O2/c10-11-9(13)6-5-7-3-1-2-4-8(7)12/h1-4,12H,5-6,10H2,(H,11,13)
24535-13-5Relevant academic research and scientific papers
Epoxy resin bearing diacylhydrazine moiety as a degradable adhesive for traceless oxidative removal
Oguri, Takahiro,Kawahara, Akie,Kihara, Nobuhiro
, p. 83 - 89 (2016/07/19)
Bisphenols functionalized with diacylhydrazine moieties and ester groups were prepared from 5-hydroxyisophthalic acid by esterification and partial hydrazination, followed by oxidative coupling of the obtained hydrazide. Ester groups with long alkyl chains or polyether increased the solubility of bisphenols in the epoxy resin. The epoxy resin was cured by heating with bisphenols in the presence of a catalytic amount of imidazole, with more rapid curing observed for more soluble bisphenols. The cured resin, with Td5?≈?300?°C, decomposed rapidly when exposed to sodium hypochlorite solution. The above resin could be used as a strong and tough adhesive for metal and glass, whereas it can be easily removed by treatment with sodium hypochlorite solution without any trace. The observed dismantling rate positively correlated with bisphenol solubility.
