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9,9-DIMETHYL-2,7-DINITROFLUORENE is a chemical with a specific purpose. Lookchem provides you with multiple data and supplier information of this chemical.

28320-58-3

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28320-58-3 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 28320-58-3 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,8,3,2 and 0 respectively; the second part has 2 digits, 5 and 8 respectively.
Calculate Digit Verification of CAS Registry Number 28320-58:
(7*2)+(6*8)+(5*3)+(4*2)+(3*0)+(2*5)+(1*8)=103
103 % 10 = 3
So 28320-58-3 is a valid CAS Registry Number.

28320-58-3SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 19, 2017

Revision Date: Aug 19, 2017

1.Identification

1.1 GHS Product identifier

Product name 9,9-dimethyl-2,7-dinitrofluorene

1.2 Other means of identification

Product number -
Other names 9,9-Dimethyl-2,7-dinitrofluoren

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:28320-58-3 SDS

28320-58-3Upstream product

28320-58-3Downstream Products

28320-58-3Relevant academic research and scientific papers

Fluorene-containing diamine monomer, polyimide film and preparation method and application thereof

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Paragraph 0109-0111; 0115, (2021/05/12)

The invention relates to the technical field of organic photoelectric polymers, and particularly relates to a fluorene-containing diamine monomer, a polyimide film and a preparation method and application thereof. The fluorene-containing diamine monomer provided by the invention has a structure as shown in a formula I defined in the description. The fluorene-containing diamine monomer provided by the invention is polymerized with a dianhydride monomer, so that the heat resistance of a polyimide film can be greatly improved, and the thermal expansion coefficient of the film can be reduced.

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