35043-12-0Relevant articles and documents
High heat-resistant polyimide films containing quinoxaline moiety for flexible substrate applications
Chen, Shuangshuang,Ding, Tong-Mei,Jiang, Wei,Liu, Tuan-Qing,Lu, Qinghua,Ma, Xiaoru,Zhang, Shu-Yu,Zheng, Feng
, (2020)
The development of thermostable polyimides (PIs) is urgently required for application in traditional aerospace and newly designing flexible-display substrates. The root to obtain intrinsic heat-resistant PIs is to seek novel monomers. Based on the high bo