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3,5-diethylbenzoic acid is an organic compound with the chemical formula C11H14O2. It is a derivative of benzoic acid, featuring two ethyl groups attached to the 3rd and 5th carbon atoms of the benzene ring. This white crystalline solid is known for its aromatic properties and is used in the synthesis of various pharmaceuticals, agrochemicals, and other chemical products. The compound has a melting point of 89-91°C and is soluble in organic solvents such as ethanol and acetone. Due to its versatile chemical structure, 3,5-diethylbenzoic acid serves as an important intermediate in the production of dyes, fragrances, and other specialty chemicals.

3854-90-8

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3854-90-8 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 3854-90-8 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 3,8,5 and 4 respectively; the second part has 2 digits, 9 and 0 respectively.
Calculate Digit Verification of CAS Registry Number 3854-90:
(6*3)+(5*8)+(4*5)+(3*4)+(2*9)+(1*0)=108
108 % 10 = 8
So 3854-90-8 is a valid CAS Registry Number.
InChI:InChI=1/C11H14O2/c1-3-8-5-9(4-2)7-10(6-8)11(12)13/h5-7H,3-4H2,1-2H3,(H,12,13)

3854-90-8SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 17, 2017

Revision Date: Aug 17, 2017

1.Identification

1.1 GHS Product identifier

Product name 3,5-diethylbenzoic acid

1.2 Other means of identification

Product number -
Other names Benzoic acid, 3,5-diethyl-

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:3854-90-8 SDS

3854-90-8Relevant academic research and scientific papers

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

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, (2014/03/21)

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Discovery and structure-activity studies of a novel series of pyrido[2,3-d]pyrimidine tyrosine kinase inhibitors

Connolly, Cleo J. C.,Hamby, James M.,Schroeder, Mel C.,Barvian, Mark,Lu, Gina H.,Panek, Robert L.,Amar, Aneesa,Shen, Cindy,Kraker, Alan J.,Fry, David W.,Klohs, Wayne D.,Doherty, Annette M.

, p. 2415 - 2420 (2007/10/03)

The inhibition of tyrosine kinase-mediated signal transduction pathways represents a therapeutic approach to the intervention of proliferative diseases such as cancer, atherosclerosis, and restenosis. A novel series of pyrido[2,3-d]pyrimidine inhibitors of the PDGFr, bFGFr, and c-Src tyrosine kinases was developed from compound library screening and lead optimization.' In addition, highly selective inhibitors of the FGFr tyrosine kinase were also discovered and developed from this novel series of pyrido[2,3-d]pyrimidines. The syntheses, biological evaluation, and structure-activity relationships of this series are reported.

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