4919-45-3Relevant academic research and scientific papers
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
-
, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
PHOTODIMERIZATION OF BENZENES IN STRAINED DIHETERAMETACYCLOPHANES
Higuchi, Hiroyuki,Kobayashi, Eiji,Sakata, Yoshiteru,Misumi, Soichi
, p. 1731 - 1740 (2007/10/02)
Double- to quadruple-layered diheterametacyclophanes containing O, S, and Se atoms in the bridge chains were synthesized by the usual methods.On irradiation, three quadruple-layered cyclophanes 1a-c undergo a photodimerization of two inner benzenes t
