59309-86-3Relevant academic research and scientific papers
A small piece of solder, tip/chip solder , pieces of solder and manufacturing method
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, (2007/10/14)
To provide a solder piece that prevents its surface on which the shear droop portion generated by the punching process is formed from becoming a sucked surface. The solder piece 1A is provided with four surfaces, namely, a first surface 11, a second surface 12, a third surface 13 and a fourth surface 14, which can be an sucked surface on the occasion of handling; a fifth surface 15 which is a surface on which a shear droop portion 15a generated by the punching process is formed and a sixth surface 16 that is opposite to the fifth surface 15. The solder piece 1A is punched out in a direction shown in an arrow A with the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14 being shared surfaces. This enables the four surfaces thereof excluding from surfaces thereof the fifth surface 15 on which the shear droop portion 15a is formed and the sixth surface 16 that is opposite to the fifth surface 15 to be formed with desired size and precision. It is configured so that any one of the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14 becomes a sucked surface and the fifth surface 15 on which the shear droop portion 15a is formed is prevented from becoming the sucked surface.
