6975-33-3Relevant articles and documents
CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE
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Paragraph 0132, (2020/02/15)
The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.
Synthesis and physicochemical properties of strong electron acceptor 14,14,15,15-tetracyano-6,13-pentacenequinodimethane (TCPQ) diimide
Li, Jie,Xiong, Yu,Wu, Qinghe,Wang, Shitao,Gao, Xike,Li, Hongxiang
supporting information, p. 6136 - 6139,4 (2020/09/16)
14,14,15,15-Tetracyano-6,13-pentacenequinodimethane (TCPQ) diimide, a new tetracyanoquinodimethane analogue with extended conjugation and imide substituents, was synthesized by double Diels-Alder reactions and a Knoevenagel condensation reaction. Experimental results showed that TCPQ diimide has a low LUMO energy level (-4.03 eV) and good solubility in organic solvents.