6975-33-3

Usage

Uses

Used in Pharmaceuticals and Cosmetics:
4-[(2-ethylhexyl)amino]-4-oxoisocrotonic acid is used as a surfactant in pharmaceuticals and cosmetics for its ability to reduce surface tension and stabilize formulations.
Used in Metal Working Fluids and Drilling Fluids:
In the metalworking and drilling industries, 4-[(2-ethylhexyl)amino]-4-oxoisocrotonic acid is used as a corrosion inhibitor to protect metal surfaces from degradation and wear.
Used as a Chelating Agent:
4-[(2-ethylhexyl)amino]-4-oxoisocrotonic acid is used as a chelating agent in metal-ion complexation, which is important for various chemical processes and reactions.
Used in Chemical Synthesis:
4-[(2-ethylhexyl)amino]-4-oxoisocrotonic acid can also act as an intermediate to synthesize other organic compounds, contributing to the development of new chemical products.
Solubility:
4-[(2-ethylhexyl)amino]-4-oxoisocrotonic acid is soluble in organic solvents such as ethanol and acetone, and it is sparingly soluble in water, which further broadens its range of applications in different industries.

InChI:InChI=1/C12H21NO3/c1-3-5-6-10(4-2)9-13-11(14)7-8-12(15)16/h7-8,10H,3-6,9H2,1-2H3,(H,13,14)(H,15,16)/b8-7-

Upstream product

• 108-31-6 maleic anhydride 
• 104-75-6 2-Ethylhexylamine 

Downstream Products

• 48149-71-9 N-(2-ethylhexyl)maleimide 

Relevant academic research and scientific papers

CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE

The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Control of thermal, mechanical, and optical properties of three-component maleimide copolymers by steric bulkiness and hydrogen bonding

N-substituted maleimides polymerize in the presence of a radical initiator to give polymers with excellent thermal stabilities and transparency. In this study, we synthesized various maleimide copolymers with styrenes and acrylic monomers to control their thermal and mechanical properties by the introduction of bulky substituents and intermolecular hydrogen bonding. Three-component copolymers of N-(2-ethylhexyl)maleimide in combination with styrene, α-methylstyrene (MSt), or 1-methylenebenzocyclopentane (BC5) as the styrene derivatives, and n-butyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, or acrylic acid as the acrylic monomers were prepared by radical copolymerization. These copolymers were revealed to exhibit excellent heat resistance by thermogravimetric analysis. Glass transition temperatures increased by the introduction of bulky MSt and BC5 repeating units. The mechanical properties of the copolymer films were improved by the introduction of intermolecular hydrogen bonding. Optical properties, such as transmittance, refractive index, Abbe number, and birefringence, were determined for the copolymers.

Synthesis and physicochemical properties of strong electron acceptor 14,14,15,15-tetracyano-6,13-pentacenequinodimethane (TCPQ) diimide

14,14,15,15-Tetracyano-6,13-pentacenequinodimethane (TCPQ) diimide, a new tetracyanoquinodimethane analogue with extended conjugation and imide substituents, was synthesized by double Diels-Alder reactions and a Knoevenagel condensation reaction. Experimental results showed that TCPQ diimide has a low LUMO energy level (-4.03 eV) and good solubility in organic solvents.