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2,2'-methylenebis[4-(1-methyl-1-phenylethyl)phenol], commonly known as Bisphenol F, is a synthetic organic compound that serves as a key ingredient in the production of various plastics, resins, and other industrial materials. It is a derivative of bisphenol A (BPA) and is widely utilized as a building block for epoxy resins. Despite its widespread use, Bisphenol F has been identified to possess endocrine-disrupting properties, which has led to growing concerns regarding its potential effects on human health and the environment. As a result, ongoing research is being conducted to better understand the risks associated with 2,2'-methylenebis[4-(1-methyl-1-phenylethyl)phenol], and there is a push towards developing safer alternatives for use in consumer products and industrial applications.

71113-22-9

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71113-22-9 Usage

Uses

Used in Plastics and Resin Manufacturing:
2,2'-methylenebis[4-(1-methyl-1-phenylethyl)phenol] is used as a key component in the production of various types of plastics and resins. Its primary application is in the manufacturing of epoxy resins, which are widely used in coatings, adhesives, and composite materials due to their excellent adhesion, mechanical strength, and chemical resistance.
Used in Coatings and Adhesives:
In the coatings industry, Bisphenol F is used as a curing agent for epoxy resins, which are employed to create high-performance coatings with excellent durability, corrosion resistance, and adhesion properties. These coatings are commonly used in automotive, aerospace, and marine applications, as well as in protective coatings for metal structures and surfaces.
Used in Composite Materials:
2,2'-methylenebis[4-(1-methyl-1-phenylethyl)phenol] is also utilized in the production of composite materials, where it serves as a matrix material for reinforcing fibers such as carbon, glass, or aramid. The resulting composites exhibit enhanced mechanical properties, making them suitable for use in various industries, including aerospace, automotive, and sports equipment manufacturing.
Used in Electronic Industry:
In the electronics industry, Bisphenol F-based epoxy resins are used as encapsulants for semiconductor devices, providing protection against environmental factors and ensuring the reliability and longevity of electronic components.
However, it is important to note that due to the endocrine-disrupting properties of Bisphenol F, there is an increasing demand for safer alternatives in various industries to minimize potential health and environmental risks. Ongoing research and development efforts are focused on creating innovative materials that can replace Bisphenol F while maintaining the desired properties and performance characteristics.

Check Digit Verification of cas no

The CAS Registry Mumber 71113-22-9 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 7,1,1,1 and 3 respectively; the second part has 2 digits, 2 and 2 respectively.
Calculate Digit Verification of CAS Registry Number 71113-22:
(7*7)+(6*1)+(5*1)+(4*1)+(3*3)+(2*2)+(1*2)=79
79 % 10 = 9
So 71113-22-9 is a valid CAS Registry Number.

71113-22-9SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 18, 2017

Revision Date: Aug 18, 2017

1.Identification

1.1 GHS Product identifier

Product name 2-[[2-hydroxy-5-(2-phenylpropan-2-yl)phenyl]methyl]-4-(2-phenylpropan-2-yl)phenol

1.2 Other means of identification

Product number -
Other names 2,2'-methylenebis[4-(2-phenylpropan-2-yl)phenol]

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:71113-22-9 SDS

71113-22-9Upstream product

71113-22-9Downstream Products

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