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7681-65-4

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7681-65-4 Usage

Chemical Description

Copper(I) iodide is a yellowish-white solid with the chemical formula CuI.

Check Digit Verification of cas no

The CAS Registry Mumber 7681-65-4 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 7,6,8 and 1 respectively; the second part has 2 digits, 6 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 7681-65:
(6*7)+(5*6)+(4*8)+(3*1)+(2*6)+(1*5)=124
124 % 10 = 4
So 7681-65-4 is a valid CAS Registry Number.
InChI:InChI=1/Cu.HI/h;1H/q+1;/p-1

7681-65-4 Well-known Company Product Price

  • Brand
  • (Code)Product description
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  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 5g

  • 383.0CNY

  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 25g

  • 1295.0CNY

  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 100g

  • 4126.0CNY

  • Detail
  • Alfa Aesar

  • (11606)  Copper(I) iodide, 98%   

  • 7681-65-4

  • 250g

  • 897.0CNY

  • Detail
  • Alfa Aesar

  • (11606)  Copper(I) iodide, 98%   

  • 7681-65-4

  • 1kg

  • 2708.0CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-50G

  • 398.97CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-250G

  • 1,103.31CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-1KG

  • 3,256.11CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-5G

  • 517.14CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-25G

  • 1,750.32CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-100G

  • 5,303.61CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-1KG

  • 37,978.20CNY

  • Detail

7681-65-4SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 16, 2017

Revision Date: Aug 16, 2017

1.Identification

1.1 GHS Product identifier

Product name iodocopper

1.2 Other means of identification

Product number -
Other names cooper iodide

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:7681-65-4 SDS

7681-65-4Synthetic route

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of t-BuOCu added to a blue-green soln. of Sm complex; ppt. sepd. and washed with 10% HNO3; ppt. of CuI insoluble in HNO3 sepd. off; remaining soln. concd. and kept at 80° until complete dissolution of a fine ppt.; cooled slowly to ca. 20°; crystal sepd.; dried; identified by elem. anal., IR;A 100%
B 97.7%
C 92.3%
LaI3(tetrahydrofuran)3
147312-03-6

LaI3(tetrahydrofuran)3

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

lanthanum tert-butoxycuprate

lanthanum tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of La complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A 90.2%
B 95%
tris(tetrahydrofurane)triiodidoneodymium(III)
113316-94-2

tris(tetrahydrofurane)triiodidoneodymium(III)

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

neodymium tert-butoxycuprate

neodymium tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of Nd complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A n/a
B 90.3%
copper(II) choride dihydrate

copper(II) choride dihydrate

potassium iodide
7681-11-0

potassium iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water pptg. from a CuCl2*2H2O soln. with an excess of KI soln.; Debye-Scherrer XRD;
iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With copper(II) sulfate In not given iodine containing compounds used;
With alkali sulfite; copper(II) sulfate In not given iodine containing compounds used;
iodine
7553-56-2

iodine

copper(I) bromide
7787-70-4

copper(I) bromide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuBr2; shaking a soln. of CuBr in concd. Br(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuCl2; shaking a soln. of CuCl in concd. Cl(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

CuClI

CuClI

Conditions
ConditionsYield
In ethanol Kinetics; alcoholic soln. of iodine addn. to AgCl in container with ground stopper, keeping for 2, 4 or 8 h at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper dichloride

copper dichloride

Conditions
ConditionsYield
In acetone on addn. of a soln. of excess I2 acetone;;
sulfur dioxide
7446-09-5

sulfur dioxide

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
in presence of Cu(2+);
copper (II)-fluoride

copper (II)-fluoride

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuF2 at 60°C; X-ray diffraction;
copper(II) ion

copper(II) ion

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With sulfur dioxide In water Cu salts from Cu minerals;;
iodine
7553-56-2

iodine

copper(ll) bromide
7789-45-9

copper(ll) bromide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(I) bromide
7787-70-4

copper(I) bromide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuBr2 at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper dichloride

copper dichloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(l) chloride

copper(l) chloride

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuCl2 at 60°C; X-ray diffraction;
copper(II) oxide

copper(II) oxide

methyl iodide
74-88-4

methyl iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In neat (no solvent) byproducts: aldehyde, O2, ethylene, methane, hydrocarbons; at about 310°C in aCO2-atmoshere;;
In neat (no solvent) on treatment of CuO with gaseous methyl iodide;;
ammonium iodide

ammonium iodide

copper(II) oxide

copper(II) oxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

ammonia
7664-41-7

ammonia

C

water
7732-18-5

water

D

iodine
7553-56-2

iodine

Conditions
ConditionsYield
In neat (no solvent) on heating to 400-500°C;;
In neat (no solvent) on heating to 400-500°C;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

silver(I) iodide

silver(I) iodide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

silver sulfide

silver sulfide

Conditions
ConditionsYield
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
potassium iodide
7681-11-0

potassium iodide

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In hydrogenchloride pptn. with KI;;
In water pptn. from the soln. of CuCl in aq. NH4Cl with KI;;>99
In water react. of CuCl with KI-soln. with passing through of N2; washing with alcohol on a filter, drying in N2 flow and then in vacuum;
In hydrogenchloride
hydrogen iodide
10034-85-2

hydrogen iodide

copper(II) sulfide

copper(II) sulfide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water formation of crystals;;
potassium iodide
7681-11-0

potassium iodide

copper(II) oxide

copper(II) oxide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With hydrogenchloride; hydroxylamine hydrochloride; gelatin In water byproducts: N2O, KCl; NH2OH*HCl, KI added rapidly to gelatin stabilized CuO suspn. with stirring for 5 h under agitation at room temp., pH adjusted to 8-9 with HCl; washed thoroughly, vacuum dried at room temp.;
copper(l) iodide
7681-65-4

copper(l) iodide

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

CuI/Chxn-Py-Al

CuI/Chxn-Py-Al

Conditions
ConditionsYield
In diethyl ether; acetonitrile at 20℃; for 2h;100%
Conditions
ConditionsYield
In 1,2-dimethoxyethane Irradiation (UV/VIS); under Ar; mole ratio NaBPh4 : CuI = 1 : 1; irradn. (254 nm) for 1 h gave deposition of Cu; deposit sepd., washed with acetone and water, and dried in vac. to give pure Cu;100%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

MeCuILi

MeCuILi

Conditions
ConditionsYield
With N,N,N,N,N,N-hexamethylphosphoric triamide In tetrahydrofuran; diethyl ether under N2, etheral soln. of MeLi was added to a stirred suspn. of CuI in THF at -10°C, HMPT was also added, stirred for 30 min at 0°C; not isolated;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetrapropylammonium iodide
631-40-3

tetrapropylammonium iodide

bis(tetrapropylammonium) tetraiododicuprate(I)

bis(tetrapropylammonium) tetraiododicuprate(I)

Conditions
ConditionsYield
In tetrahydrofuran at 48℃; Inert atmosphere;100%
In acetonitrile dissolving CuI and NPr4I in MeCN, concg.;
copper(l) iodide
7681-65-4

copper(l) iodide

C48H38N2O6

C48H38N2O6

C48H38CuIN2O6

C48H38CuIN2O6

Conditions
ConditionsYield
In dichloromethane; acetonitrile at 20℃; for 2h;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetra-(n-butyl)ammonium iodide
311-28-4

tetra-(n-butyl)ammonium iodide

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

Conditions
ConditionsYield
In tetrahydrofuran; tert-butyl methyl ether at 10 - 48℃; for 0.75h; Inert atmosphere;100%
In tetrahydrofuran at 50℃; Inert atmosphere;600 g
Stage #1: copper(l) iodide; tetra-(n-butyl)ammonium iodide In tetrahydrofuran at 50℃; Inert atmosphere;
Stage #2: In tert-butyl methyl ether at 6℃; for 1h; Inert atmosphere;
600 g
copper(l) iodide
7681-65-4

copper(l) iodide

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

C22H40B10CuN2P2S2(1+)*I(1-)

C22H40B10CuN2P2S2(1+)*I(1-)

Conditions
ConditionsYield
In tetrahydrofuran at 20℃; for 18h; Inert atmosphere; Schlenk technique; stereoselective reaction;100%
copper(l) iodide
7681-65-4

copper(l) iodide

lead(II) nitrate

lead(II) nitrate

potassium iodide
7681-11-0

potassium iodide

copper lead iodide

copper lead iodide

Conditions
ConditionsYield
Stage #1: copper(l) iodide; lead(II) nitrate; potassium iodide In water for 2h;
Stage #2: at 620℃; for 72h; Sealed tube;
100%
copper(l) iodide
7681-65-4

copper(l) iodide

5-chloro-2-(pent-4-yn-1-yl)pyrimidine
126215-85-8

5-chloro-2-(pent-4-yn-1-yl)pyrimidine

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

Conditions
ConditionsYield
With potassium carbonate In N,N-dimethyl-formamide at 20℃; for 3h; Inert atmosphere;100%
copper(l) iodide
7681-65-4

copper(l) iodide

N,N-diethylphenylazothioformamide

N,N-diethylphenylazothioformamide

C22H30Cu2I2N6S2

C22H30Cu2I2N6S2

Conditions
ConditionsYield
In tetrahydrofuran100%
copper(l) iodide
7681-65-4

copper(l) iodide

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine
1380612-64-5

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine

C38H50Cu3I3N10

C38H50Cu3I3N10

Conditions
ConditionsYield
In tetrahydrofuran for 24h; Inert atmosphere; Schlenk technique;100%
copper(l) iodide
7681-65-4

copper(l) iodide

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]
591215-89-3

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]
820219-08-7

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]

Conditions
ConditionsYield
In tetrahydrofuran; ethanol equiv. amt. of solid CuI and B-compd. were mixed in THF:EtOH=4:0.3, stirring for 2.5 h; volatiles were removed in vac., solid was washed with Et2O, dried in vac., elem. anal.;99.4%
copper(l) iodide
7681-65-4

copper(l) iodide

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde
345964-32-1

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde
607714-16-9

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde

Conditions
ConditionsYield
With triethylamine; dichlorobis(triphenylphosphine)palladium[II] In tetrahydrofuran; hexane99%
copper(l) iodide
7681-65-4

copper(l) iodide

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate
607713-99-5

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate
607714-00-1

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate

Conditions
ConditionsYield
dichlorobis(triphenylphosphine)palladium[II] In hexane; triethylamine99%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

lithium dimethylcuprate
15681-48-8

lithium dimethylcuprate

Conditions
ConditionsYield
In diethyl ether at -78 - -35℃; for 0.333333h; Inert atmosphere;99%
In tetrahydrofuran Ar, ratio CuI:CH3Li = 1:2;
In hexane
pyridine
110-86-1

pyridine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(pyridine)4I4

Cu4(pyridine)4I4

Conditions
ConditionsYield
With KI In water pyridine was added to stirred soln. of CuI in concd. aq. KI; filtered; washed (satd. aq. KI, H2O, MeOH, hexane); recrystd. (CH2Cl2/pentane); dried (vac.);99%
In ethanol at 20℃; for 0.5h; Sealed tube;80%
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

Iodotrifluoroethylene
359-37-5

Iodotrifluoroethylene

cadmium
7440-43-9

cadmium

trifluorovinyl copper
102682-87-1

trifluorovinyl copper

Conditions
ConditionsYield
In N,N-dimethyl-formamide byproducts: CdI2; N2; slight excess of acid-washed Cd powder added to alkene soln.; mild exothermic reaction after induction period; removal of excess Cd by press. filtrn. under N2; stirring mixt. at 0 °C for half h with CuI or CuBr; final warming to room temp.; (19)F NMR;99%
copper(l) iodide
7681-65-4

copper(l) iodide

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Conditions
ConditionsYield
In not given treated at room temp. for 24 h; further intermediate; followed by UV and by ESI-MS;99%
piperidine
110-89-4

piperidine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(piperidine)4I4

Cu4(piperidine)4I4

Conditions
ConditionsYield
In dichloromethane piperidine was dissolved in CH2Cl2 under N2 at 25°C; CuI was added; mixt. was stirred under N2 until CuI dissolved;99%
With potassium iodide In acetone excess of ligand in acetone soln. is added to a stirred soln. of CuI in concd. aq. KI soln., soln. kept standing for a few min, pptn.; filtn., washing with satd. aqueous KI, water, MeOH and hexanes, product is dried in vac.;>99
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8O)2]
73605-90-0

cis[(μ-N(t-Bu)P)2(NC4H8O)2]

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2
1038988-00-9

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
N,N'-ethylenethiourea
96-45-7

N,N'-ethylenethiourea

copper(l) iodide
7681-65-4

copper(l) iodide

tris(iodobis(ethylenethiourea)copper(I))
1094209-90-1

tris(iodobis(ethylenethiourea)copper(I))

Conditions
ConditionsYield
In N,N-dimethyl-formamide CuI, ethylenethiourea and few drops DMF were ground together for severalminutes; DMF was evapd.;99%
In water CuI and ethylenethiourea in water were heated to boiling; supernatant was decanted while hot and cooled, product was collected andwashed with water; elem. anal.;50%
copper(l) iodide
7681-65-4

copper(l) iodide

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate
443287-45-4

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate

benzene
71-43-2

benzene

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

Conditions
ConditionsYield
In dichloromethane; acetonitrile; benzene stoich., CuI added to soln. of Mo complex in CH2Cl2, evapd., dissolved (CH3CN), benzene deposited; crystd. for 3 d, elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene
161265-03-8

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I
1218788-80-7

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I

Conditions
ConditionsYield
In acetonitrile99%
In CH2Cl299%
In acetonitrile at 50℃; for 2h;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene
776315-37-8

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)
1231929-92-2

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron
1159850-42-6

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)
1231929-91-1

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane
13648-83-4

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)
1311311-97-3

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)

Conditions
ConditionsYield
In chloroform-d1 inert gas; CuI (0.36 mmol) added to soln. of ligand (0.70 mmol), mixt. stirred at room temp. for 30 min; filtered, evapd.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

tris(3,5-dimethylpyrazolyl)methane
28791-97-1

tris(3,5-dimethylpyrazolyl)methane

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI
1392097-26-5

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI

Conditions
ConditionsYield
In acetonitrile under N2; soln. of ligand in MeCN added to stirred soln. of CuI in MeCN;stirred for 2 h; filtered; ppt. dried under vac.; elem. anal.;99%
at 20℃;

7681-65-4Relevant articles and documents

Datta, R. L.,Sen, J. N.

, p. 750 - 759 (1917)

Nano-particulate CuI film formed on porous copper substrate by iodination

Yang, Yang,Li, Xuefei,Zhao, Bin,Chen, Huilan,Bao, Ximao

, p. 400 - 404 (2004)

A nano-particulate thin CuI film is fabricated by iodination of a porous copper substrate that was prepared by using an alumina mask and characteristic properties of these films are studied.

Highly Selective Fluorescent Probe Based on 2-(2′-Dansylamidophenyl)-Thiazole for Sequential Sensing of Copper(II) and Iodide Ions

Kim, Bo-Yeon,Pandith, Anup,Cho, Chan Sik,Kim, Hong-Seok

, p. 163 - 168 (2019)

A novel highly selective fluorescent probe based on 2-(2′-dansylamidophenyl)-4-phenylthiazole (1) is developed for sequential sensing of copper(II) and iodide ions in acetonitrile. The fluorescence mechanism is based on cation-induced inhibition of excited-state intramolecular hydrogen transfer, intramolecular charge transfer, and metal–ligand electron/charge transfer. Subsequent iodide-induced extrusion of copper(II) results in partial revival of fluorescence. Probe 1 and its ensemble with copper (II) show high selectivity for copper(II) and iodide ions, respectively, in acetonitrile solution.

Synthesis of nano-CuI and its catalytic activity in the thermal decomposition of ammonium perchlorate

Liu, Yaqing,Cheng, Yun,Lv, Shiqi,Liu, Chunsheng,Lai, Junling,Luo, Genxiang

, p. 3885 - 3892 (2015)

Nano-CuI was fabricated by an element-direct-reaction route at 40°C in acetonitrile, and used as a catalyst in the thermal decomposition of ammonium perchlorate. The effects of polyvinyl pirrolidone (PVP) as an additive in the preparation of the catalyst and the addition amount of the catalyst in thermal decomposition reaction on the catalytic activity were investigated. Meanwhile, the morphologies and composition of the catalyst were also identified by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy. The results showed that nano-CuI can remarkably decrease the higher decomposition temperature of ammonium perchlorate by more than 100°C, and that the temperature can be further reduced by using the nano-CuI catalyst with PVP as an additive in preparation. In addition, smaller crystallite size and increasing addition amount of nano-CuI in the thermal decomposition are favorable for improving its catalytic activity.

2D compound formation during copper dissolution: An electrochemical STM study

Broekmann,Hai,Wandelt

, p. 3971 - 3977 (2006)

The reversible formation of a 2D-CuI film on Cu(1 0 0) is studied by means of cyclic voltammetry in combination with electrochemical scanning tunneling microscopy. Exposing the Cu(1 0 0) electrode surface to an acidic and iodide containing electrolyte (5 mM H2SO4/1 mM KI) leads to the formation of a well ordered c(p × 2)-I adsorbate layer at potentials close to the onset of the anodic copper dissolution reaction. Copper dissolution starts at slightly more positive potentials preferentially at step edges in the presence of the iodide adlayer via the removal of copper material from kink sites at step edges. This increase of mobile Cu+ ions causes the local exceeding of the CuI solubility product (pKL = 11.3), thereby giving rise to the nucleation and growth of a laterally well ordered 2D-CuI film. Key structural motifs of the growing CuI film are closely related to the (1 1 1) plane of bulk CuI. Quite intriguing, the 2D-CuI film does not act as a passive layer. Copper dissolution proceeds even in the presence of this binary compound via an inverse step flow mechanism.

Synthesis, morphology, and optical properties of cui microcrystals

Shevchenko,Piskunovich,Zhuravkov,Bokshits

, p. 630 - 634 (2012)

We have studied the effect of synthesis conditions on the luminescence spectra of ultrafine CuI powders. The results demonstrate that synthesis conditions (the reductant of Cu2+, the anion of the copper(II) salt, initial solution concentrations, and the presence of a stabilizer) influence the size and shape of the forming CuI particles and, accordingly, their luminescence spectrum. The highest luminescence intensity near λmax ?720 nm (λex ?370 nm) is offered by regularly shaped tetrahedral particles 1.1-1.2 μm in average size. Pleiades Publishing, Ltd., 2012.

Dimorphism of a new Cul coordination polymer: Synthesis, crystal structures and properties of catena[Cul(2-iodopyrazine-N)] and poly[Cul(μ2-2-iodopyrazine-N,N′)]

Naether, Christian,Wriedt, Mario,Jess, Inke

, p. 2391 - 2397 (2003)

Two modifications of the new copper(I) iodide coordination polymer Cul(2-iodopyrazine) were obtained by the reaction of Cul and 2-iodopyrazine in acetonitrile. During this reaction, intensely yellow crystals of form I appear first which transform within several minutes to intensely red crystals of form II which is the thermodynamically most stable form at room temperature. In catena[Cul(2-iodopyrazine-N)] (form I; a = 4.1830 (6) A; b = -10.814 (1) A; c = 17.961 (4) A; V = 812.5 (2) A3; orthorhombic; P212121; Z = 4), corrugated Cul double chains are found in which each copper atom is coordinated by one additional 2-iodopyrazine ligand. In poly[Cul(μ-2-iodopyrazine-N, N′)] (form II; a = 4.2679 (5) A; b = 13.942 (2) A, c = 13.017 (2) A, b = 92.64 (1)°; V = 773.76 (2) A3; monoclinic; P21/c; Z = 4), Cul single chains occur which are connected via μ-N,N′ coordination by the 2-iodopyrazine ligands to layers parallel to (010). The thermal behavior of both forms was investigated using simultaneous differential thermoanalysis, thermogravimetry, and mass spectrometry as well as differential scanning calorimetry and temperature resolved X-ray powder diffraction. On heating, both forms decompose to copper(I) iodide, and the decomposition temperature of form I is significantly lower than that of form II. From all experiments, there is no indication of a phase transition of one form into the other or for the formation of a phase with lower amine content.

Nanophases in mechanochemically synthesized AgI-CuI system: Structure, phase stability and phase transitions

Mohan, D. Bharathi,Sunandana

, p. 1669 - 1677 (2004)

Nanoscale crystallites of Ag-rich (Ag1-xCuxI, x=0.05, 0.10, 0.15 and 0.25), Cu-rich (Cu1-yAgyI, y=0.05, 0.10, 0.15 and 0.25) and intermediate Ag1-xCuxI (x=0.50) solid solutions and end members AgI, CuI with sizes in the range of 46-13 nm were synthesized by attrition at ambient temperature in a soft mechanochemical reaction (MCR) of Ag, Cu and I. Monophasic γ-AgI (zincblende, a=638pm) with disordered Ag+ sublattice and the crystallite size of about ~31 nm was realized in the case of Ag0.75Cu0.25I (x=0.25) composition. Lattice parameter decreases linearly from 649 to 604pm with increasing Cu concentration in the AgI-CuI system validating Vegard's law. Smallest size (~13 nm) agglomerated nanocrystals were realized in the Cu-rich composition Cu0.75Ag0.25I (a=615pm), while unagglomerated uniform-sized (~17 nm) and spherical shape nanocrystallites of Ag0.50Cu0.50I (a=626pm) with maximum strain were synthesized for sensor applications using MCR. Differential scanning calorimetry study shows the systematic changes in the phase transition temperature with Cu substitution. Ag-rich composition posses less enthalpy (ΔH (x or Cu=0.05, 0.10, 0.15, 0.25)=6.0, 6.11, 6.6, 6.3 in kJ/mol) and entropy (ΔS (y or Ag=0.05, 0.10, 0.15, 0.25)=14.15, 14.1, 15.03, 13.6 in J/molK) when compared to undoped AgI (ΔH=9.63kJ/mol, ΔS=22.8J/molK) implying greater thermal stability of γ-phase due to Cu-strengthened Ag-I bond. Enhanced entropy (ΔS=8.17J/molK) in Cu0.75Ag0.25I (Cu-rich) solid solutions relative to CuI (ΔS=1.0J/molK) indicates Ag-induced cation disorder. Fifteen percent Ag-doped CuI (Cu0.85Ag0.15I) nanocrystals apparently behave like microscopic p-n junctions with currents in the range of 10-6-10-8A characterized by a non-linear I-V curve.

ESR study of the electronic properties of the new organic conductors κ-(BEDT-TTF)2Cu[N(CN)2]X, X = Br; I

Kataev,Winkel,Knauf,Gruetz,Khomskii,Wohlleben,Crump,Hahn,Tebbe

, p. 24 - 34 (1992)

The electron spin resonance data together with AC susceptibility and low field microwave absorption measurements are reported for the two organic conductors κ-(BEDT-TTF)2Cu[N(CN)2]X, with X = Br; I. The bromine containing salt is the

Preparation and characterization of CuI nanorods using Cu(dmg)2 as precursor via water-in-oil (w/o) microemulsions

Li, Xue-Liang,Zhu, Xiao-Yun,Duan, Ti-Lan,Qian, Yi-Tai

, p. 526 - 529 (2006)

CuI nanorods have been firstly prepared by water-in-oil microemulsions using Cu(dmg)2 as precursor at low temperature as low as 70 °C. X-ray diffraction (XRD) and transmission electron microscopy (TEM) measurements show that the CuI nanorods are pure γ-phase crystals with diameters ranging from 50 to 80 nm and lengths up to 500 nm. UV-vis spectrum reveals that the nanorods exhibit a blue shift and possess of wider band gap energy. Electrochemical impedance spectroscopy (EIS) reveals the nanorods own larger grain boundary resistance. Results of comparative experiments indicate that the rod-like structure of Cu(dmg)2 crystals leads the CuI crystals growing in one direction especially and the reverse microemulsion system plays a crucial role in making products symmetrical and uniform.

Preparation of porous spherical CuI nanoparticles

Yang, Ming,Xu, Jin-Zhong,Xu, Shu,Zhu, Jun-Jie,Chen, Hong-Yuan

, p. 628 - 630 (2004)

Porous spherical CuI nanoparticles with an average diameter of 0.3-0.6 μm have been prepared by a simple reaction between CuO suspension, NH 2OH·HCl and KI in the presence of deionized gelatin at room temperature.

Wojakowska, A.

, p. 2433 - 2440 (1989)

2-Benzoylpyridine thiosemicarbazone as a novel reagent for the single pot synthesis of dinuclear CuI-CuII complexes: Formation of stable copper(ii)-iodide bonds

Lobana, Tarlok S.,Khanna, Sonia,Butcher, Ray J.

, p. 4845 - 4851 (2012)

2-Benzoylpyridine thiosemicarbazone {R1R2C 2N2·N3H-C1(S)-N 4H2, R1 = py-N1, R2 = Ph; Hbpytsc} with copper(i) iodide in acetonitrile-dichloromethane mixture has formed stable CuII-I bonds in a dark green CuII iodo-bridged dimer, [Cu2II(μ-I)2(η 3-N1,N2,S-bpytsc)2] 1. Copper(i) bromide also formed similar CuII-Br bonds in a dark green Cu II bromo-bridged dimer, [Cu2II(μ-Br) 2(η3-N1,N2,S-bpytsc) 2] 3. The formation of dimers 1 and 3 appears to be due to a proton coupled electron transfer (PCET) process wherein copper(i) loses an electron to form copper(ii), and this is accompanied by a loss of -N3H proton of Hbpytsc ligand resulting in the formation of anionic bpytsc-. When copper(i) iodide was reacted with triphenylphosphine (PPh3) in acetonitrile followed by the addition of 2-benzoylpyridine thiosemicarbazone in dichloromethane (Cu:PPh3:Hbpytsc in the molar ratio 1:1:1), both CuII dimer 1 and an orange CuI sulfur-bridged dimer, [Cu2II2(μ-S-Hbpytsc)2(PPh 3)2] 2 were formed. Copper(i) bromide with PPh3 and Hbpytsc also formed CuII dimer 3 and an orange CuI sulfur-bridged dimer, [Cu2IBr2(μ-S-Hbpytsc) 2(PPh3)2] 4. While complexes 2 and 4 exist as sulfur-bridged CuI dimers, 1 and 3 are halogen-bridged. The central Cu2S2 cores of 2 and 4 as well as Cu2X 2 of 1 (X = I) and 3 (X = Br) are parallelograms. One set of Cu II-I and CuII-Br bonds are short, while the second set is very long {1, Cu-I, 2.565(1), 3.313(1) A; 3, Cu-Br, 2.391(1), 3.111(1) A}. The Cu...Cu separations are long in all four complexes {1, 4.126(1); 2, 3.857(1); 3, 3.227(1); 4, 3.285(1) A}, more than twice the van der Waals radius of a Cu atom, 2.80 A. The pyridyl group appears to be necessary for stabilizing the CuII-I bond, as this group can accept π-electrons from the metal. The Royal Society of Chemistry 2012.

THE APPLICATION OF PHOTO-REDUCTION OF THIN CUPROUS IODIDE FILM FOR METAL IMAGE FORMATION

Shimidzu, Naoki,Masuda, Hideki,Ohno, Shin

, p. 961 - 964 (1984)

The surface chemical properties of cuprous-iodide (CuI) film evaporated on a polymer layer containing a precursor reducing agent, 2-isopropoxy-1,4-naphtoquinone (IPNQ), were markedly affected by UV irradiation.The CuI was reduced by photoproducts of the IPNQ and the surface reductants attracted the zinc vapor in a vacuum evaporation vessel.Thus the UV exposure resulted in the zinc vapor deposition.

Synthesis, structures and antimicrobial activity of copper derivatives of N -substituted imidazolidine-2-thiones: Unusual bio-activity against Staphylococcus epidermidis and Enterococcus faecalis

Lobana, Tarlok S.,Aulakh, Jaspreet K.,Sood, Heena,Arora, Daljit S.,Garcia-Santos, Isabel,Kaur, Manpreet,Duff, Courtney E.,Jasinski, Jerry P.

, p. 9886 - 9900 (2018)

The main objective of this study was to explore the antimicrobial activity of several copper(i) complexes with N,S-donor thio-ligands against Gram positive bacteria, namely Staphylococcus aureus (MTCC 740), Staphylococcus epidermidis (MTCC 435), and Enter

A thermoelectric copper-iodide composite from the pyrolysis of a well-defined coordination polymer

Bai, Shi-Qiang,Wong, Ivy Hoi Ka,Lin, Ming,Young, David James,Hor, T. S. Andy

, p. 5564 - 5569 (2018)

Coordination polymer 1 was prepared from CuI and a flexible [SNS] ligand L in acetonitrile. The thermal decomposition of 1 yielded a CuI-rich thermoelectric carbon composite 2, which is relatively light, thermally stable and robust. Composite 2 possesses high Seebeck coefficients (700-950 μV K-1) from rt to 204 °C after an optimization cycle.

Structural and NMR study of the lithiated defect thiospinels LixCu0.07[Ti2]S4 (0 < x < 2)

James, A. C. W. P.,Goodenough, J. B.,Clayden, N. J.

, p. 356 - 365 (1988)

Oxidative extraction of copper from the normal thiospinel Cu[Ti2]S4 followed by chemical lithiation of the resulting defect thiospinel enabled the metallic, lithiated defect thiospinels LixCu0.07[Ti2]S4 to be prepared with high purity and chemical homogeneity. X-ray and neutron powder-diffraction studies of LixCu0.07T[Ti2]S4 showed that lithium insertion into Cu0.07[Ti2]S4 is topotactic and that the inserted lithium occupies only the 16c-octahedral sites of the thiospinel framework at all lithium compositions. Static and MAS 7Li NMR spectra of LixCu0.07[Ti2]S4 exhibited a single lithium resonance with a small chemical shift relative to lithium acetate dihydrate at all lithium compositions; the chemical shift increased linearly with increasing lithium content.

Diamagnetic properties of molten cuprous halides and their mixtures

Shirakawa, Yoshiyuki,Tamaki, Sigeru,Okazaki, Hideo,Azuma, Masayoshi

, p. 544 - 551 (1993)

The magnetic susceptibilities of molten cuprous halides and their mixtures have been measured as a function of temperature. The temperature dependence of susceptibilities in molten CuBr and CuI show small paramagnetic deviations compared to those in molten potassium halides. The composition dependence of CuCl-CuI and CuBr-CuI melts obey the Wiedemann rule, while the molten CuCl-CuBr system exhibits a large deviation from this rule.

Efficient dye-sensitized solar cell based on a new porphyrin complex as an inorganic photosensitizer

Nasirian, Azam,Mirkhani, Valiollah,Moghadam, Majid,Tangestaninejad, Shahram,Mohammadpour Baltork, Iraj

, (2020/06/22)

Abstract: The synthesis of new porphyrin complexes that can absorb light in a broad range of the spectrum is very important for getting a high efficiency in dye-sensitized solar cells. The primary reason for using these complexes is good photophysical characteristic like good absorption and high quantum efficiency. Most of the metal porphyrin shows good photophysical characteristics with changing their ligands. In this work, the synthesis of a new Zn-porphyrin complex, that has a good spectral and electrochemical characteristic, is reported. Then, this complex is used as a dye in dye-sensitized solar cells, using titanium dioxide as a semiconductor. The application of this complex in a dye-sensitized nanocrystalline TiO2 solar cell has indicated a short circuit density of 11.60 mA, an open circuit potential of 0.65 V with an overall efficiency of 5.33%. The overall conversion efficiency of this system is due to the efficient electron injection into the conduction band during light absorption. Graphic abstract: In this work, the synthesis of a new Zn-porphyrin complex, together with its spectral and electrochemical properties, is described. The application of this complex in a dye-sensitized nanocrystalline TiO2 solar cell indicated a short circuit density of 11.60 mA, an open circuit potential of 0.65V with an overall efficiency of 5.33%.[Figure not available: see fulltext.]

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