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4-(1-adamantyl)-1,3-diglycidyloxybenzene, also known as ADGE, is a chemical compound belonging to the diglycidyl ether family with the molecular formula C23H28O3. It features a unique structure that includes an adamantane group attached to a benzene ring through a diglycidyl ether linkage. 4-(1-adamantyl)-1,3-diglycidyloxybenzene is recognized for its excellent thermal stability and chemical resistance, which are key attributes for its use in various high-performance applications.

928164-82-3

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928164-82-3 Usage

Uses

Used in Adhesives Production:
4-(1-adamantyl)-1,3-diglycidyloxybenzene is used as a curing agent for epoxy resins in the production of adhesives, due to its high reactivity and compatibility with a wide range of resins, which enhances the adhesive's performance and durability.
Used in Coatings Industry:
In the coatings industry, 4-(1-adamantyl)-1,3-diglycidyloxybenzene is utilized as a curing agent to improve the thermal stability and chemical resistance of the coatings, providing them with enhanced durability and protection against harsh environmental conditions.
Used in Industrial Composites:
4-(1-adamantyl)-1,3-diglycidyloxybenzene is employed as a key component in the manufacturing of industrial composites, where its high reactivity and compatibility contribute to the creation of materials with superior mechanical properties and resistance to various chemical and environmental stresses.
Used in Aerospace Industry:
In the aerospace sector, 4-(1-adamantyl)-1,3-diglycidyloxybenzene is used as a curing agent for epoxy resins in the production of high-performance materials that are critical for the construction of aircraft components, where thermal stability and chemical resistance are paramount.
Used in Automotive Industry:
4-(1-adamantyl)-1,3-diglycidyloxybenzene is utilized in the automotive industry as a component in the manufacturing of materials for vehicle parts that require high durability and resistance to various environmental factors, such as temperature fluctuations and chemical exposure.
Used in Electronics Industry:
In the electronics industry, 4-(1-adamantyl)-1,3-diglycidyloxybenzene is used in the production of materials for electronic components that demand high thermal stability and resistance to chemicals, ensuring the reliability and longevity of the components.

Check Digit Verification of cas no

The CAS Registry Mumber 928164-82-3 includes 9 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 6 digits, 9,2,8,1,6 and 4 respectively; the second part has 2 digits, 8 and 2 respectively.
Calculate Digit Verification of CAS Registry Number 928164-82:
(8*9)+(7*2)+(6*8)+(5*1)+(4*6)+(3*4)+(2*8)+(1*2)=193
193 % 10 = 3
So 928164-82-3 is a valid CAS Registry Number.

928164-82-3Relevant academic research and scientific papers

ADAMANTYL GROUP-CONTAINING EPOXY-MODIFIED (METH)ACRYLATE AND RESIN COMPOSITION CONTAINING THE SAME

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, (2009/04/24)

The present invention provides an adamantyl group containing epoxy-modified (meth)acrylate and a resin composition containing it which are imparted by transparency, optical characteristics such as (durable) light resistance and the like, heat-resistance,

ADAMANTANE DERIVATIVE, RESIN COMPOSITION CONTAINING SAME, AND OPTOELECTRONIC MEMBER AND SEALING AGENT FOR ELECTRONIC CIRCUIT USING THOSE

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Page/Page column 17-18, (2008/12/04)

Disclosed is an adamantane derivative which provides a cured product excellent in optical characteristics such as transparency and light resistance, long-term heat resistance, electrical characteristics such as and dielectric constant, and low water absorption. Also disclosed are a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent. Specifically disclosed are an adamantane derivative represented by the formula (I-1) below, a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate, all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent.

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