16669-54-8

A new two-step synthesis method of macrobicyclic hexaamide ligands LH6 (I and II) with double condensation of triethyl nitrilotriacetate and 1,4(1,2)-diaminobenzene was developed. The cyclization does not require high dilution and template techniques. Two new hexaamide ligands were prepared in good yields according to the proposed method.

The macrobicyclic hexaamide ligand LH6 has been synthesized from double condensation of triethyl ester of nitrilotriacetic acid and 1,2-diaminobenzene in 60% yield.

In the aim of creating superoleophobic surfaces using monomers with short perfluorinated chains, to avoid drawbacks associated with PFOA, original semifluorinated (C4F9, C6F13) 3,4-ethylenedioxypyrrole derivatives were synthesized. These monomers were obtained using the faster synthetic method than previously described with some analogues, characterized and electrochemically polymerized on gold plates. The obtained surfaces exhibited superhydrophobic (contact angle with water of 157° and 158°, respectively) and oleophobic properties (contact angle with hexadecane: 88° and 108°, respectively). The comparison between these new monomers and already published analogue EDOP6 confirms the importance of the bipolaronic form of conductive polymer for obtaining surface nanoporosity and as a consequence improving surface oleophobicity. Thus, little change in the molecule design of the connector and the spacer of the monomer can have a significant influence on the surface oleophobicity.

A non-aqueous lubricating composition containing a major amount of an oil of lubricating viscosity and a minor amount, in the range of 0.02% to 5% by weight, of at least one compound represented by the structural formula (I): wherein R4 represents H or a C1 to C9 hydrocarbyl group or x, y and z are independently integers in the range 1 to 6; and R1, R2 and R3 each independently represent a C1 to C10 hydrocarbyl or substituted hydrocarbyl group.

A photocurable composition includes: (A) an epoxy group-containing polymer compound having repeating units represented by the following formula (1), where R1 to R4 are each a hydrocarbon group, m is an integer of 1 to 100, a, b, c and d are each 0 or a positive number, such that 0 (c+d)/(a+b+c+d) ≤ 1.0, and X and Y are each the formula (2) or (3), provided that at least one group of the formula (3) is present, (B) a photoacid generator represented by the formula (8) and (C) a solvent.

The present invention relates to: a resist composition such as a chemically amplified resist composition for providing an excellent pattern profile even at a substrate-side boundary face of resist, in addition to a higher resolution in photolithography for micro-fabrication, and particularly in photolithography adopting, as an exposure source, KrF laser, ArF laser, F2 laser, ultra-short ultraviolet light, electron beam, X-rays, or the like; and a patterning process utilizing the resist composition. The present invention provides a chemically amplified resist composition comprising one or more kinds of amine compounds or amine oxide compounds (except for those having a nitrogen atom of amine or amine oxide included in a ring structure of an aromatic ring) at least having a carboxyl group and having no hydrogen atoms covalently bonded to a nitrogen atom as a basic center.

A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R1 is H, methyl or trifluoromethyl, X is a single bond or methylene, m is 1 or 2, and the hydroxyl group attaches to a secondary carbon atom. The composition is improved in resolution when processed by lithography.

A photoacid generator has formula (1). A chemically amplified resist composition comprising the photoacid generator has advantages including a high resolution, focus latitude, long-term PED dimensional stability, and a satisfactory pattern profile shape.

A family of N-substituted 3,4-allcylenedioxypyrrole includes monomers for of formula (I) electropolymerization to conjugated polymers and key intermediates for the preparation of the monomers. The preparation of the //-substituted 3,4-aJkylenedioxypyrτole

Iron complexes of porphyrins (and corroles to a lesser extent) are the first catalysts to utilize ammonia for the synthesis of N-free amino acid esters. The Royal Society of Chemistry 2006.

A high resolution resist material comprising an acid generator is provided so that high sensitivity and high resolution for high energy rays of 300 nm or less, small line-edge roughness, and excellence in heat stability and storage stability are obtained. Moreover, a pattern formation method using this resist material are provided. Specifically, a novel compound of the following general formula (1); and a positive resist material comprising this compound preferably as a photo acid generator, and a base resin; are provided. This positive resist material may contain a basic compound or a dissolution inhibitor. Further, the present invention provides a pattern formation method comprising the steps of applying this positive resist material on a substrate, then heat-treating the material, exposing the treated material to a high energy ray having a wavelength of 300 nm or less via a photo mask, optionally heat-treating the exposed material, and developing the material using a developer.

Novel tertiary (meth)acrylate compounds having a lactone structure are polymerizable into polymers having improved transparency, especially at the exposure wavelength of an excimer laser and dry etching resistance. Resist compositions comprising the polymers are sensitive to high-energy radiation, have a high resolution, and lend themselves to micropatterning with electron beams or deep-UV rays.