Detail of "7330-46-3"

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Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

All Rights Reserved. Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki (Hitachi Chemical Company, Ltd., Japan). PCT Int. Appl. WO 2007004569 A1 11 Jan 2007, 61pp. DESIGNATED STATES: W: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC; RW: AT, BE, BF, BJ, CF, CG, CH, CI, CM, CY, DE, DK, ES, FI, FR, GA, GB, GR, IE, IS, IT, LU, MC, ML, MR, NE, NL, PT, SE, SN, TD, TG, TR. (Japanese).In this article, certain chemicals are used. Some of their cas registry numbers are 918499-97-5 and 7330-46-3 (World Intellectual Property Organization). CODEN: PIXXD2. APPLICATION: WO 2006-JP313114 30 Jun 2006. PRIORITY: JP 2005-196328 5 Jul 2005; JP 2005-332955 17 Nov 2005. DOCUMENT TYPE: Patent CA Section: 74 (Radiation Chemistry, Photochemistry, and Photographic and Other Reprographic Processes) Section cross-reference(s): 38, 76 The invention relates to a photosensitive adhesive compn. comprising (A) polyimide of 80 to 180 mg/KOH acid value having carboxyl as a side chain, (B) radiation-polymerizable compd. and (C) photopolymn. initiator. The compn. provides good pattern profile by alkali development and generates tackiness at low temp. .