Detail of "96-20-8"

Reference

Extractant design for the separation of enantiomers by reactive extraction

Extractant design for the separation of enantiomers by reactive extraction. Steensma, M.; Kuipers, N. J. M.; de Haan, A. B.; Kwant, G. (University of Twente, Enschede 7500 AE, Neth.). AIChE Annual Meeting, Conference Proceedings, San Francisco, CA, United States, Nov. 16-21, 2003, 396-403. American Institute of Chemical Engineers: New York, N. Y. ISBN: 0-8169-0941-5(English) 2003. CODEN: 69EZVH. DOCUMENT TYPE: Conference; (computer optical disk) CA Section: 47 (Apparatus and Plant Equipment) This paper discusses how an enantioselective extractant for enantiomer sepn. by reactive extn. can be designed. After identification of promising selectors from literature for a good intrinsic selectivity, the chem. has to be 'engineered' to obtain a good operational selectivity. As illustration of this approach, the development of N-(2-hydroxydodecyl)-L-hydroxyproline copper(II) complex (OH-C12Hyp) as enantioselective extractant for chiral sepn. of simple amino-alcs. is described. Butanol/hexane mixts. can be used as solvent. The compn. of the mixt. has a pronounced effect on the selectivity and capacity of the extn.: at pH = 9.7 and using 75% hexane in butanol as solvent, an operational selectivity of 1.8 and distribution ratios of 4.1 vs. 2.3 are obtained for norephedrine enantiomers.Except for chemicals metioned above, 96-20-8 and 87068-89-1 are also used. .

Electroless copper coating solutions

Electroless copper coating solutions. (Hitachi Chemical Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58144465 A2 27 Aug 1983 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C23C003-02. APPLICATION: JP 82-27584 22 Feb 1982. DOCUMENT TYPE: Patent CA Section: 56 (Nonferrous Metals and Alloys) Section cross-reference(s): 76 The solns.In this article, certain chemicals are used. Some of their cas registry numbers are 96-20-8 and 7783-96-2 contain Cu salt(s), complexing agent(s), reducing agent(s), and pH modifier(s), and have substance(s) for supplying Ag ion and amino alcs. The solns. greatly improve the tensile strength and bending fatigue strength of the coated Cu, and are useful for the circuit formation on printed circuit boards. Thus, a soln. (pH 11.8) contg. CuSO4 0.04 mol/L, EDTA 0.05 mol/L, formaldehyde 0.03 mol/L, Ag 50 mg/L, and ethanolamine 2 g/L was prepd. A Cu foil (25-35 m-thick) obtained by dipping a stainless steel plate in the soln. showed a tensile strength of 65 kg/mm2 and bending fatigue strength (by JIS-P-8115 method) 1600 times. .