- Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
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- PHOTODIMERIZATION OF BENZENES IN STRAINED DIHETERAMETACYCLOPHANES
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Double- to quadruple-layered diheterametacyclophanes containing O, S, and Se atoms in the bridge chains were synthesized by the usual methods.On irradiation, three quadruple-layered cyclophanes 1a-c undergo a photodimerization of two inner benzenes t
- Higuchi, Hiroyuki,Kobayashi, Eiji,Sakata, Yoshiteru,Misumi, Soichi
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p. 1731 - 1740
(2007/10/02)
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