C O M M U N I C A T I O N S
expected.13,14 (See the Supporting Information for more details and
comparison with previous works.)
The charge transport in OTFT devices is critically dependent
on the thin semiconducting layer less than a few nanometer
thickness adjacent to the gate dielectric surface.15,16 Therefore, the
excellent electrical properties of the OTFT devices prepared with
the blend active layer arises from the nearly pure TIPS-pentacene
layer segregated and crystallized at the bottom substrate interface,
as indicated by the results of Figure 2b and Figure 3. Moreover,
significant improvements in key performance characteristics (field-
effect mobility, on/off ratio, and threshold voltage) of the OTFT
devices are most likely due to the important changes in the chemical
and physical structure at the semiconductor/dielectric interface, as
compared with neat TIPS-pentacene system. This is the topic that
is poorly understood at the moment and hence needs much further
study, in order to realize successful technological applications of
organic semiconductors.
Figure 3. GIXD patterns of spin-cast films of TIPS-pentacene/PRMS (Mr,n
≈ 575 000 g ·mol-1) blend, observed for the as-cast and the 90 °C-annealed
films. The scale of the scattering vector is denoted in the film plane by qxy.
The (00l) diffraction spots are indicated by the arrows in the figure.
Acknowledgment. The authors acknowledge the helpful dis-
cussions with Drs. Dean DeLongchamp and Eric Lin of NIST, and
the financial support by the grants from the Korea Science and
Engineering Foundation (F01-2006-000-10200-0) and the Informa-
tion Display R&D Center (F0004031-2007-23), one of the 21st
Century Frontier R&D Program of Korean Government. This
research was also supported by the Chemistry and Molecular
Engineering Program of the Brain Korea 21 Project and by Samsung
Electronics Co., LTD. GIXD facility at PAL is funded by Korean
government and operated by POSTECH. The NIST Center for
Neutron Research is funded by the U.S. Department of Commerce.
Figure 4. (a) Transfer characteristic and (b) output characteristic of bottom-
gate/bottom-contact OTFT with TIPS-pentacene/PRMS (Mr,n ≈ 575 000
g·mol-1) blend film. The field-effect mobility calculated in the saturation
regime is 0.54 cm2/Vs.
the film thickness (z) direction). As discussed by Anthony and his
co-workers,8,9,11,12 such an orientation is essential to obtaining a
high field-effect mobility of TIPS-pentacene active layer in OTFT
devices. Therefore, we found that the phase-segregated TIPS-
pentacene layers in the blend films with the high molecular-mass
PRMS exhibited a highly crystalline structure with the desired
crystal orientation on silicon solid substrate.
Supporting Information Available: Description of the employed
materials and experimental methods (NR, GIXD, OTFT device fabrica-
tion). This material is available free of charge via the Internet at http://
pubs.acs.org.
References
Figure 4 shows the performance characteristics of an excellent
bottom-gate/bottom-contact OTFT device prepared with the TIPS-
pentacene blend (1:1 ratio by mass) with the high molecular-mass
PRMS of Mr,n ≈ 575 000 g ·mol-1. The OTFT devices were
fabricated with thermally grown SiO2 dielectric and the surface-
modified (with pentafluorobenzenethiol) Au electrodes. The active
layer of neat TIPS-pentacene or the blend with PRMS was deposited
by drop-casting, relevant to the ink-jet printing process, from 0.5%
(by mass) solution of TIPS-pentacene or the blend solution in
toluene, followed by solvent evaporation at 90 °C for 20 min. Neat
TIPS-pentacene devices exhibited an average field-effect mobility
of 0.05 cm2/Vs with on/off ratio of 105 and threshold voltage |Vth|
≈ 4 V. But they showed a serious problem of large fluctuations of
device performance due to the poor film-forming characteristics
and variation in crystal-growth behavior in the channel area (length
L ) 100 µm and width W ) 1000 µm). In comparison, the OTFT
devices fabricated with the blend with PRMS of Mr,n ≈ 575 000
g·mol-1 showed a much higher average mobility of 0.3 cm2/Vs
and on/off ratio of 5 × 105, together with a reduced threshold
voltage |Vth| < 2 V (see Figure 4). Moreover, the deposited film
quality was nearly uniform and satisfactory in all the fabricated
OTFTs, and therefore the device performance variation decreased
significantly. As an additional benefit, since the semiconducting
layer was encapsulated in situ by the insulating polymer layer (see
Figure 2b), an improved stability of the active layer in OTFTs is
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