Einecs 234-648-2

Base Information

• Chemical Name: Einecs 234-648-2
• CAS No.: 12019-69-1
• Molecular Formula: H10Cu6Sn5
• Molecular Weight: 974.826
• European Community (EC) Number: 234-648-2
• Mol file: 12019-69-1.mol

Synonyms:Copper, compound with tin (6:5);EINECS 234-648-2;12019-69-1;NS00087472

Chemical Property of Einecs 234-648-2

Chemical Property:

• Boiling Point: °Cat760mmHg
• Flash Point: °C
• Density: g/cm³
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 973.08333
• Heavy Atom Count: 11
• Complexity: 0

Purity/Quality:

99% ^*data from raw suppliers

Safty Information:

• Pictogram(s):  
• Hazard Codes: 

MSDS Files:

SDS file from LookChem

Useful:

• Canonical SMILES: [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Sn].[Sn].[Sn].[Sn].[Sn]

Technology Process of Einecs 234-648-2

There total 21 articles about Einecs 234-648-2 which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield:

→ Cu6Sn5 (12019-69-1)

Guidance literature:

In neat (no solvent);

DOI:10.1016/j.jallcom.2014.06.015

Reference yield:

copper(II) choride dihydrate + tin(II) chloride dihdyrate (10025-69-1) → Cu6Sn5 (12019-69-1)

Guidance literature:

With sodium tetrahydroborate; In water; chlorides and C6H5Na3O7*2H2O, mixed, dissolved in water; soln. added dropwise to aq. alkaline NaBH4 soln. under strong stirring at room temp.; aged 6 h in water bath at 80°C; filtered, washed with water and acetone for 3 times; dried at 105°C for 24 h under vac.;

DOI:10.1016/j.jallcom.2008.11.159

Reference yield:

tin(ll) chloride + copper dichloride → Cu6Sn5 (12019-69-1)

Guidance literature:

With KBH₄; H(OCH₂CH₂)nOH; In water; byproducts: H2, CuH(x), SnH(x); High Pressure; mixing CuCl2 and SnCl2 (1.2:1), addn. of water, addn. of KBH4 and polyethylene glycol (average molecular weight 600 or 20000), heating to 80°C in autoclave; cooling to room temp. after 5 h, centrifugation, washing with water, washing with ethanol, drying at 100°C under vacuum for 24 h, XRD;

DOI:10.1016/j.poly.2010.02.035

upstream raw materials:

tin

copper

tin(II) chloride dihdyrate

copper(II) sulfate

Downstream raw materials:

tin

Cu₃Sn

Refernces

• 1、 Meschel,Pavlu,Nash. "The thermochemical behavior of some binary shape memory alloys by high temperature direct synthesis calorimetry". . p. 5256 - 5262. Retrieved 2011.
• 2、 Simic, V.,Marinkovic, Z.. "". . p. 259 - 266. Retrieved 1983.
• 3、 Flandorfer,Saeed,Luef,Sabbar,Ipser. "Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds". . p. 34 - 39. Retrieved 2007.
• 4、 Kim,Tu,Totta. "Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers". . p. 2204 - 2206. Retrieved 1996.
• 5、 Gu, Yue,Zhao, Xiuchen,Li, Yi,Liu, Ying,Wang, Yong,Li, Zhenyu. "Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates". . p. 39 - 47. Retrieved 2015.
• 6、 Liu, Sheng,Li, Qi,Chen, Yuxi,Zhang, Fengju. "Carbon-coated copper-tin alloy anode material for lithium ion batteries". . p. 694 - 698. Retrieved 2009.
• 7、 Suh,Tu,Tamura. "Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu". . . Retrieved 2007.
• 8、 Liu, Xiaoying,Huang, Mingliang,Zhao, Yanhui,Wu,Wang, Lai. "The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering". . p. 433 - 438. Retrieved 2010.
• 9、 Wang, Ke,He, Xiangming,Wang, Li,Ren, Jianguo,Jiang, Changyin,Wan, Chunrong. "Preparation of Cu6Sn5-encapsulated carbon microsphere anode materials for Li-ion batteries by carbothermal reduction of oxides". . p. A1859-A1862. Retrieved 2006.
• 10、 Beattie,Dahn. "Single-bath electrodeposition of a combinatorial library of binary Cu1-xSnx alloys". . p. C457-C460. Retrieved 2003.