C₂₂H₄₃O₄Si₂SeC₆H₅

Base Information

Chemical Name:C₂₂H₄₃O₄Si₂SeC₆H₅
CAS No.:950747-12-3
Molecular Formula:C₂₈H₄₈O₄SeSi₂
Molecular Weight:583.818
Hs Code.:

C<sub>22</sub>H<sub>43</sub>O<sub>4</sub>Si<sub>2</sub>SeC<sub>6</sub>H<sub>5</sub>

Synonyms:C₂₂H₄₃O₄Si₂SeC₆H₅

Suppliers and Price of C₂₂H₄₃O₄Si₂SeC₆H₅

Supply Marketing:

Business phase:: The product has achieved commercial mass production^*data from LookChem market partment

Manufacturers and distributors:

Manufacture/Brand
Chemicals and raw materials
Packaging
price

Total 0 raw suppliers

Chemical Property of C₂₂H₄₃O₄Si₂SeC₆H₅

Chemical Property:

Purity/Quality:

Safty Information:

Pictogram(s):
Hazard Codes:

MSDS Files:

Useful:

Technology Process of C₂₂H₄₃O₄Si₂SeC₆H₅

There total 15 articles about C₂₂H₄₃O₄Si₂SeC₆H₅ which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield: 75.0%

: 950747-11-2
(4S,5E,7S,9R)-4,7-bis[(tert-butyldimethylsilyl)oxy]-9-methyl-5-nonen-9-olide

: 5707-04-0
Phenylselenyl chloride

: 950747-12-3
C₂₂H₄₃O₄Si₂SeC₆H₅

Guidance literature:: (4S,5E,7S,9R)-4,7-bis[(tert-butyldimethylsilyl)oxy]-9-methyl-5-nonen-9-olide; With lithium diisopropyl amide; In tetrahydrofuran; hexane; at -78 ℃; for 1h;

Phenylselenyl chloride; With N,N,N,N,N,N-hexamethylphosphoric triamide; In tetrahydrofuran; hexane; at -78 - -40 ℃; for 1.5h; Further stages.;
DOI:10.1016/j.tet.2007.06.038

Reference yield:

: 950746-98-2
6-[(4-methoxybenzyl)oxy]-1-trimethylsilyl-1-hexyn-3-one

: 950747-12-3
C₂₂H₄₃O₄Si₂SeC₆H₅

Guidance literature:: Multi-step reaction with 13 steps

1.1: Pichia minuta IAM 12215, yeast

2.1: 99 percent / potassium carbonate / methanol / 5 h / 0 °C

3.1: 100 percent / imidazole / dimethylformamide / 20 °C

4.1: tri-n-butyltin hydride; azobis(isobutyronitrile) / benzene / 12 h / Heating

4.2: 937.2 mg / iodine / CH₂Cl₂ / 0.5 h / 0 °C

5.1: 97 percent / DDQ / CH₂Cl₂; H₂O / 3 h / 0 °C

6.1: 95 percent / ethyldiisopropylamine; dimethyl sulfoxide; SO₃*pyridine / CH₂Cl₂ / 0.33 h / 0 °C

7.1: 100 percent / 2-methyl-2-butene; sodium dihydrogen phosphate; sodium chlorite / 2-methyl-propan-2-ol; H₂O / 20 °C

8.1: Et₃N / tetrahydrofuran / 5 h / 20 °C

9.1: 100 percent / DMAP / benzene / 8.5 h / 20 °C

10.1: p-toluenesulfonic acid monohydrate / acetone / 3 h / 20 °C

11.1: 77.0 mg / chromium(II) chloride; nickel(II) chloride / dimethylformamide / 0 - 20 °C

12.1: 95 percent / imidazole / dimethylformamide / 15 h / 20 °C

13.1: LDA / tetrahydrofuran; hexane / 1 h / -78 °C

13.2: 75 percent / hexamethylphosphoric triamide / tetrahydrofuran; hexane / 1.5 h / -78 - -40 °C

With 1H-imidazole; chromium dichloride; dmap; sodium chlorite; sodium dihydrogen phosphate; 2-methyl-but-2-ene; pyridine-SO₃ complex; 2,2'-azobis(isobutyronitrile); tri-n-butyl-tin hydride; potassium carbonate; toluene-4-sulfonic acid; dimethyl sulfoxide; triethylamine; N-ethyl-N,N-diisopropylamine; 2,3-dicyano-5,6-dichloro-p-benzoquinone; nickel dichloride; lithium diisopropyl amide; In tetrahydrofuran; methanol; hexane; dichloromethane; water; N,N-dimethyl-formamide; acetone; tert-butyl alcohol; benzene; 11.1: Nozaki-Hiyama-Kishi coupling;
DOI:10.1016/j.tet.2007.06.038

Reference yield:

: 957300-51-5
(±)-6-(4-methoxybenzyloxy)-1-(trimethylsilyl)hex-1-yn-3-ol

: 950747-12-3
C₂₂H₄₃O₄Si₂SeC₆H₅

Guidance literature:: Multi-step reaction with 14 steps

1.1: 98 percent / Dess-Martin periodinane / CH₂Cl₂ / 6 h / 20 °C

2.1: Pichia minuta IAM 12215, yeast

3.1: 99 percent / potassium carbonate / methanol / 5 h / 0 °C

4.1: 100 percent / imidazole / dimethylformamide / 20 °C

5.1: tri-n-butyltin hydride; azobis(isobutyronitrile) / benzene / 12 h / Heating

5.2: 937.2 mg / iodine / CH₂Cl₂ / 0.5 h / 0 °C

6.1: 97 percent / DDQ / CH₂Cl₂; H₂O / 3 h / 0 °C

7.1: 95 percent / ethyldiisopropylamine; dimethyl sulfoxide; SO₃*pyridine / CH₂Cl₂ / 0.33 h / 0 °C

8.1: 100 percent / 2-methyl-2-butene; sodium dihydrogen phosphate; sodium chlorite / 2-methyl-propan-2-ol; H₂O / 20 °C

9.1: Et₃N / tetrahydrofuran / 5 h / 20 °C

10.1: 100 percent / DMAP / benzene / 8.5 h / 20 °C

11.1: p-toluenesulfonic acid monohydrate / acetone / 3 h / 20 °C

12.1: 77.0 mg / chromium(II) chloride; nickel(II) chloride / dimethylformamide / 0 - 20 °C

13.1: 95 percent / imidazole / dimethylformamide / 15 h / 20 °C

14.1: LDA / tetrahydrofuran; hexane / 1 h / -78 °C

14.2: 75 percent / hexamethylphosphoric triamide / tetrahydrofuran; hexane / 1.5 h / -78 - -40 °C

With 1H-imidazole; chromium dichloride; dmap; sodium chlorite; sodium dihydrogen phosphate; 2-methyl-but-2-ene; pyridine-SO₃ complex; 2,2'-azobis(isobutyronitrile); tri-n-butyl-tin hydride; potassium carbonate; Dess-Martin periodane; toluene-4-sulfonic acid; dimethyl sulfoxide; triethylamine; N-ethyl-N,N-diisopropylamine; 2,3-dicyano-5,6-dichloro-p-benzoquinone; nickel dichloride; lithium diisopropyl amide; In tetrahydrofuran; methanol; hexane; dichloromethane; water; N,N-dimethyl-formamide; acetone; tert-butyl alcohol; benzene; 12.1: Nozaki-Hiyama-Kishi coupling;
DOI:10.1016/j.tet.2007.06.038