[(CNC₆H₃Me₂-2,6)4Cu₂(oxalato)]

Base Information

• Chemical Name: [(CNC₆H₃Me₂-2,6)4Cu₂(oxalato)]
• CAS No.: 871560-76-8
• Molecular Formula: C₃₈H₃₆Cu₂N₄O₄
• Molecular Weight: 739.82
• Mol file: 871560-76-8.mol

Synonyms:

Chemical Property of [(CNC₆H₃Me₂-2,6)4Cu₂(oxalato)]

Chemical Property:

Purity/Quality:

Safty Information:

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MSDS Files:

Useful:

Technology Process of [(CNC₆H₃Me₂-2,6)4Cu₂(oxalato)]

There total 2 articles about [(CNC₆H₃Me₂-2,6)4Cu₂(oxalato)] which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield:

bis[[bis(trimethylsilyl)acetylene]copper(I)] oxalate (625457-69-4) + 2,6-dimethylphenyl isonitrile (119072-54-7,2769-71-3) → [(CNC6H3Me2-2,6)4Cu2(oxalato)] (871560-76-8)

Guidance literature:

In dichloromethane; (N2); using Schlenk techniques; dissolving of Cu2(C2O4)((CSi(CH3)3)2)2 in CH2Cl2; addn. of 4 equiv. of CNC6H3Me2 via syringe at room temp.; stirring for 2 h; concn. under reduced pressure, crystn. at -20°C; filtration, washing with small amt. of cold (-30°C) CH2Cl2 or CHCl3, drying undervac.;

DOI:10.1016/j.jorganchem.2005.04.055

Reference yield:

copper(I) oxide + 2,6-dimethylphenyl isonitrile (119072-54-7,2769-71-3) + oxalic acid (144-62-7,97993-78-7) → [(CNC6H3Me2-2,6)4Cu2(oxalato)] (871560-76-8)

Guidance literature:

In dichloromethane; (N2); using Schlenk techniques; dissolving of Cu2O in CH2Cl2; addn. of 4equiv. of oxalic acid and CNC6H3Me2; stirring for 3 h at room temp.; filtration, concn. under reduced pressure, crystn. at -20°C; filtration, washing with small amt. of cold (-30°C) CH2Cl2, drying under vac.; elem. anal.;

DOI:10.1016/j.jorganchem.2005.04.055

upstream raw materials:

bis[[bis(trimethylsilyl)acetylene]copper(I)] oxalate

2,6-dimethylphenyl isonitrile

oxalic acid