103946-55-0

Basic information

• Product Name: DI(CYCLOHEXENEEPOXIDEMETHYL)ETHER
• Synonyms: DI(CYCLOHEXENEEPOXIDEMETHYL)ETHER
• CAS NO: 103946-55-0
• Molecular Formula: C14H22O3
• Molecular Weight: 238.325
• Mol File: 103946-55-0.mol

Chemical Properties

• Boiling Point: 340.928°C at 760 mmHg
• Flash Point: 114.572°C
• Appearance: /
• Density: 1.122g/cm³
• Vapor Pressure: 0mmHg at 25°C
• Refractive Index: 1.512
• CAS DataBase Reference: DI(CYCLOHEXENEEPOXIDEMETHYL)ETHER(CAS DataBase Reference)
• NIST Chemistry Reference: DI(CYCLOHEXENEEPOXIDEMETHYL)ETHER(103946-55-0)
• EPA Substance Registry System: DI(CYCLOHEXENEEPOXIDEMETHYL)ETHER(103946-55-0)

Safety Data

• Hazardous Substances Data: 103946-55-0(Hazardous Substances Data)

Usage

InChI:InChI=1/C14H22O3/c1-3-11-13(16-11)5-9(1)7-15-8-10-2-4-12-14(6-10)17-12/h9-14H,1-8H2

Upstream product

• 72581-32-9 cyclohex-3-enylmethanol 
• 108541-48-6 [(cyclohex-3-en-1-yl)methyl]methanesulfonate 
• 103668-33-3 3-hydroxymethylcyclohexene 

Relevant articles and documents

PHOTOCURABLE COMPOSITION, CURED PRODUCT AND OPTICAL COMPONENT USING SAME

Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm3)1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R1 to R18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.

CURABLE EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, DIOLEFIN COMPOUND AND PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR DIEPOXY COMPOUND

An object of the present invention is to provide a curable epoxy resin composition, which is cured to provide a cured product having a high glass-transition temperature and particularly having excellent balance between heat resistance and transparency. The present invention relates to a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing agent (B), or a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing catalyst (C). [Formula 1] wherein R 1 to R 22 , which may be the same or different, each represent a hydrogen atom, a methyl group or an ethyl group; and m and n, which may be the same or different, each represent an integer of 1 to 4.