117211-08-2

Upstream product

• 92-88-6 4,4'-Dihydroxybiphenyl 
• 41481-62-3 4,4′-bis(allyloxy)-1,1′-biphenyl 
• 6942-01-4 3,3'-diallylbiphenyl-4,4'-diol 
• 106-89-8 epichlorohydrin 

Downstream Products

• 1422984-21-1 3,3'-(4,4'-bis(oxirane-2-ylmethoxy)biphenyl-3,3'-diyl)bis(propane-3,1-diyl)bis(triethoxysilane) 

Relevant academic research and scientific papers

Epoxy compound using thiol-ene reaction and method for preparing the same, and composite of organic-inorganic materials comprising a cured product thereof and method for preparing the composite

The present invention relates to an epoxy compound having an alkoxysilylalkyl-S-alkyl group and a method for preparing the same, and a composite of organic-inorganic materials comprising a cured product thereof and a method for preparing the composite. Th

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION COMPRISING SAME, CURED PRODUCT MADE THEREFROM, AND USE THEREOF

The present invention relates to an alkoxysilyl-based epoxy compound which exhibits excellent heat resistance characteristics, more particularly, a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a composite, and/or which exhibits excellent flame retardancy in a cured product, and which eliminates the necessity of a separate silane coupling agent. The present invention also relates to a method for preparing the compound, and to a composition and cured product comprising the compound. According to the present invention, provided are: an alkoxysilyl-based epoxy compound having at least one alkoxysilyl group and at least two epoxy groups; a method for preparing the alkoxysilyl-based epoxy compound by means of the ring-opening of the epoxy of a starting material and alkoxysilylation; an epoxy composition comprising the epoxy compound; and a cured product made therefrom and the use thereof. The efficiency of the chemical bonding of the cured product, which is a composite of the composition comprising a novel alkoxysilyl-based epoxy compound according to the present invention, is improved when a composite is formed not only by chemical bonding between an alkoxysilyl group of the epoxy compound and a filler, but also by chemical bonding between alkoxysilyl groups of the epoxy compound having the alkoxysilyl groups. Accordingly, the compound of the present invention exhibits excellent heat resistance characteristics, such as a low CTE and a high glass transition temperature in a composite, and/or exhibits excellent flame retardancy in a cured product.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.