6942-01-4

Usage

Uses

Used in Adhesives Industry:
2,2-diallyl-4,4'-biphenol is used as a component in the production of adhesives for its high thermal stability and resistance to chemicals, contributing to the creation of strong and durable adhesives.
Used in Coatings Industry:
In the coatings industry, 2,2-diallyl-4,4'-biphenol is used as a monomer in the synthesis of polymers, enhancing the durability and chemical resistance of the coatings.
Used in Composite Materials Industry:
2,2-diallyl-4,4'-biphenol is utilized in the manufacturing of composite materials due to its valuable properties, such as high thermal stability and resistance to chemicals, which improve the overall performance of the materials.
Used in Electronic Components Production:
This chemical compound is used in the production of electronic components, where its properties contribute to the creation of reliable and high-performance components.
Used as a Flame Retardant:
2,2-diallyl-4,4'-biphenol is employed as a flame retardant in various industrial applications, providing an additional layer of safety and protection against fire hazards.

Upstream product

• 92-88-6 4,4'-Dihydroxybiphenyl 
• 106-95-6 allyl bromide 
• 41481-62-3 4,4′-bis(allyloxy)-1,1′-biphenyl 
• 71597-85-8 (p-hydroxyphenyl)boronic acid 
• 540-38-5 p-Iodophenol 
• 95-50-1 1,2-dichloro-benzene 
• 91-66-7 N,N-diethylaniline 

Downstream Products

• 493-75-4 3,3'-diallyl-5,5'-bis(diethylaminomethyl)biphenyl-4,4'-diol 
• 117211-08-2 2,2'-((3,3'-diallylbiphenyl-4,4'-diyl)bis(oxy)bis(methylene))dioxirane 
• 1422984-24-4 (3,3’,3”-(2,6-bis(oxirane-2-ylmethoxy)naphthalene-1,3,5-triyl)tris(propane-3,1-diyl))tris(triethoxysilane) 
• 1422984-26-6 3,3',3,3'-(4,4'-bis(oxirane-2-ylmethoxy)biphenyl-3,3',5,5'-tetrayl)tetrakis(propane-3,1-diyl)tetrakis(triethoxysilane) 
• 1422984-25-5 2,2'-(3,3',5,5'-tetraallylbiphenyl-4,4'-diyl)bis(oxy)bis(methylene)dioxirane 
• 1422984-23-3 2,2'-(3,3',5-triallylbiphenyl-4,4'-diyl)bis(oxy)bis(methylene)dioxirane 
• 1422984-21-1 3,3'-(4,4'-bis(oxirane-2-ylmethoxy)biphenyl-3,3'-diyl)bis(propane-3,1-diyl)bis(triethoxysilane) 
• 85841-93-6 3,3'-dipropyl-5,5'-bis(1-pyrrolidinylmethyl) <1,1-biphenyl>-4,4'-diol dihydrochloride hydrate 

Relevant academic research and scientific papers

Preparation of biomimetic membrane with hierarchical structure and honeycombed through-hole for enhanced oil–water separation performance

Efficient oil–water separation plays a vital role in treating large amounts of industrial wastewater. However, current traditional separation methods are entwined with problems such as low efficiency and poor operability. Herein, we reported a nanofiber based on electrospinning and electrospray technology and spraying microspheres on the surface of a fiber mat for efficient oil–water separation. Owing to the electrostatic repulsion among the microspheres, the surface of the developed membrane had a honeycomb-like through-hole structure and super-high oil–water separation efficiency and oil flux. After 10 cycles, the membrane showed good separation efficiency and flux. This innovative work may provide a new idea and method for the design of biomimetic biopolymers, with broad application prospects in the field of oil–water separation.

Epoxy resin with long alkyl side chain and preparation method and curing method thereof

The invention discloses epoxy resin with a long alkyl side chain as well as a preparation method and a curing method thereof, and belongs to the technical field of epoxy resin toughening. The structural formula of the epoxy resin monomer with the long alk

Small Molecule NF-κB Inhibitors as Immune Potentiators for Enhancement of Vaccine Adjuvants

Adjuvants are added to vaccines to enhance the immune response and provide increased protection against disease. In the last decade, hundreds of synthetic immune adjuvants have been created, but many induce undesirable levels of proinflammatory cytokines including TNF-α and IL-6. Here we present small molecule NF-κB inhibitors that can be used in combination with an immune adjuvant to both decrease markers associated with poor tolerability and improve the protective response of vaccination. Additionally, we synthesize a library of honokiol derivatives identifying several promising candidates for use in vaccine formulations.

Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate

The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate

The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1) and having a weight average molecular weight of 3,000 to 500,000. There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.

Hydroxylated biphenyls as tyrosinase inhibitor: A spectrophotometric and electrochemical study

A small collection of C2-symmetry hydroxylated biphenyls was prepared by straightforward methods and the capability to act as inhibitors of tyrosinase has been evaluated by both spectrophotometric and electrochemical assays. Our attention was f

Synthesis of honokiol analogues and evaluation of their modulating action on VEGF protein secretion and telomerase-related gene expressions

A group of 36 biphenyl derivatives structurally related to honokiol were synthesized by means of Suzuki coupling reactions. Their cytotoxicities were evaluated and compared to that of honokiol. Some of the compounds were then evaluated for their ability to downregulate the secretion of the VEGF protein and the expression of the VEGF, hTERT, and c-Myc genes; the two latter involved in the activation of telomerase in tumoral cells. Some of the synthetized derivatives showed promising pharmacological features as they exhibited IC50 values in low micromolar range, good therapeutic margins, and a multiple mode of action on tumor cells based on the inhibition of VEGF and, at the same time, of the expression of genes related to the activation of telomerase.

Epoxy compound using thiol-ene reaction and method for preparing the same, and composite of organic-inorganic materials comprising a cured product thereof and method for preparing the composite

The present invention relates to an epoxy compound having an alkoxysilylalkyl-S-alkyl group and a method for preparing the same, and a composite of organic-inorganic materials comprising a cured product thereof and a method for preparing the composite. Th

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION COMPRISING SAME, CURED PRODUCT MADE THEREFROM, AND USE THEREOF

The present invention relates to an alkoxysilyl-based epoxy compound which exhibits excellent heat resistance characteristics, more particularly, a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a composite, and/or which exhibits excellent flame retardancy in a cured product, and which eliminates the necessity of a separate silane coupling agent. The present invention also relates to a method for preparing the compound, and to a composition and cured product comprising the compound. According to the present invention, provided are: an alkoxysilyl-based epoxy compound having at least one alkoxysilyl group and at least two epoxy groups; a method for preparing the alkoxysilyl-based epoxy compound by means of the ring-opening of the epoxy of a starting material and alkoxysilylation; an epoxy composition comprising the epoxy compound; and a cured product made therefrom and the use thereof. The efficiency of the chemical bonding of the cured product, which is a composite of the composition comprising a novel alkoxysilyl-based epoxy compound according to the present invention, is improved when a composite is formed not only by chemical bonding between an alkoxysilyl group of the epoxy compound and a filler, but also by chemical bonding between alkoxysilyl groups of the epoxy compound having the alkoxysilyl groups. Accordingly, the compound of the present invention exhibits excellent heat resistance characteristics, such as a low CTE and a high glass transition temperature in a composite, and/or exhibits excellent flame retardancy in a cured product.

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.