117771-99-0Relevant articles and documents
High-throughput determination of the composition-dependent interdiffusivities in Cu-rich fcc Cu-Ag-Sn alloys at 1073 K
Xu, Huixia,Chen, Weimin,Zhang, Lijun,Du, Yong,Tang, Chengying
, p. 687 - 693 (2015/05/27)
Abstract Based on the recently developed pragmatic numerical inverse method for determining the composition-dependent interdiffusivities in a ternary system by using a single diffusion couple, high-throughput determination of the interdiffusivities in Cu-rich fcc Cu-Ag-Sn alloys at 1073 K was performed in the present work. The composition-dependent interdiffusivity matrices along the entire diffusion paths of five fcc Cu-Ag-Sn diffusion couples were obtained. The reliability of the interdiffusivities determined by the pragmatic numerical inverse method was first validated by Fick's second law applied to numerical simulation of composition profiles and interdiffusion fluxes for each diffusion couple. The excellent agreement between the simulated results and the experimental data was obtained. In order to further validate their reliability, the traditional Matano-Kirkaldy method was employed to evaluate the interdiffusivities at the intersection point of the diffusion paths for every two diffusion couples. The good agreement between the interdiffusivities determined by the pragmatic numerical inverse method and those by the traditional Matano-Kirkaldy method was also observed. These facts indicate that the interdiffusivities determined by the pragmatic numerical inverse method are reliable.
Electrochemically deposited tin-silver-copper ternary solder alloys
Kim, Bioh,Ritzdorf, Tom
, p. C53-C60 (2008/10/08)
A study on film properties of electrochemically deposited tin-silver-copper (SnAgCu) alloys was performed with an alkaline bath. This research focused on the bath and process development for dendrite-free, near-eutectic SnAgCu alloy deposition through the investigation of cathodic polarization, morphological transition, and film composition. Effects of process parameters on surface morphology, film composition, and diffusion-limited current density (LCD) were also examined. Ternary alloys were obtained only when the current density was driven beyond the mass-transfer limitation of noble metals (silver and copper), which seemed to cause the transition of surface morphology and film composition with increasing current density. The morphological transition occurred through four stages (dendrites, suppression of dendrites, nodules, and columns/dendrites), and the content of noble metals in the film tended to drop with increasing current density. With increasing the concentration of noble metals, bath temperature, and agitation, the morphology at low current densities became increasingly dendrite-dominated and the content of noble metals in the film was enhanced at a fixed current density. The morphology of stage four was influenced by the ratio of the applied current density to the LCD, where the LCD was significantly influenced by the metal concentration, bath temperature, and agitation.
