12159-07-8

Basic information

• Product Name: COPPER SILICIDE
• Synonyms: coppersilicide(cu5si);COPPER SILICIDE;Coppersilicidecm;pentacopper silicide;COPPER SILICIDE, 99.4%;COPPER SILICIDE: 99.5%, -0.8CM;COPPER SILICIDE, COARSE GRANULES;Copper silicide, 99.5% (metals basis)
• CAS NO: 12159-07-8
• Molecular Formula: Cu5Si
• Molecular Weight: 345.82
• EINECS: 235-286-8
• Mol File: 12159-07-8.mol
• Article Data: 0

Chemical Properties

• Melting Point: 825°C
• Appearance: Silver/Pieces
• Density: 7.7 - 7.8
• Vapor Pressure: 54300mmHg at 25°C
• Water Solubility: Insoluble in water.
• CAS DataBase Reference: COPPER SILICIDE(CAS DataBase Reference)
• NIST Chemistry Reference: COPPER SILICIDE(12159-07-8)
• EPA Substance Registry System: COPPER SILICIDE(12159-07-8)

Safety Data

• TSCA: Yes
• Hazardous Substances Data: 12159-07-8(Hazardous Substances Data)

Usage

Chemical Properties

6.35mm and down pieces [ALF93]

Uses

Copper silicide?thin film?is used for?passivation?of?copper-based chips, where it serves to suppress?diffusion?and?electromigration?and serves as a?diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.

InChI:InChI=1/5Cu.Si

Related news

Coverage-driven phase transition of COPPER SILICIDE (cas 12159-07-8) monolayer on Si (111)07/30/2019

The characterization and control of atomic substitution process is crucial in fabricating high-quality two-dimensional layered compound materials and tuning their physical properties. With intensity-voltage low energy electron microscopy (IV-LEEM), we found that the concentration of copper in th...detailed