145672-99-7

Upstream product

• 80-05-7 BPA 
• 71449-73-5 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol 
• 106-95-6 allyl bromide 
• 26306-34-3 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether 
• 1745-89-7 2,2-bis(3-allyl-4-hydroxyphenyl)propane 
• 3739-67-1 bisphenol A diallyl ether 

Relevant academic research and scientific papers

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS, COMPOSITION, CURED PRODUCT THEREOF, USE THEREOF AND PREPARING METHOD OF ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS

The present invention relates to an alkoxysilyl compound having two or more alkoxysilyl groups (hereinafter, referred to as ″alkoxysilyl compound″) showing an excellent heat-resistance in a composite, a composition and a cured product comprising the same, an use thereof, and a method for preparing the alkoxysilyl compound. The alkoxysilyl composition comprising the novel alkoxysilyl compound, according to the present invention, in a composite, shows improved heat-resistance, i.e., an effect of decreasing CTE of the alkoxysilyl composition, or an effect of increasing glass transition temperature or not showing glass transition temperature (hereinafter, referred to as ″Tg less″) by forming a chemical bond between the alkoxysilyl group and a filler (fibers and/or particles). Further, the cured product comprising the alkoxysilyl compound according to the present invention shows an excellent flame retardant property due to the alkoxysilyl group. Moreover, when the alkoxysilyl composition according to the present invention is applied to a metal film of a substrate, an excellent adhesion to the metal film is exhibited due to a chemical bond between a functional group on a surface of the metal film and the alkoxysilyl group.

Investigations of thiol-modified phenol derivatives for the use in thiol-ene photopolymerizations

Thiol-ene photopolymerizations gain a growing interest in academic research. Coatings and dental restoratives are interesting applications for thiol-ene photopolymerizations due to their unique features. In most studies the relative flexible and hydrophilic ester derivative, namely pentaerythritoltetra(3-mercaptopropionate) (PETMP), is investigated as the thiol component. Thus, in the present study we are encouraged to investigate the performance of more hydrophobic ester-free thiol-modified bis-and trisphenol derivatives in thiol-ene photopolymerizations. For this, six different thiol-modified bis-and trisphenol derivatives exhibiting four to six thiol groups are synthesized via the radical addition of thioacetic acid to suitable allyl-modified precursors and subsequent hydrolysis. Compared to PETMP better flexural strength and modulus of elasticity are achievable in thiol-ene photopolymerizations employing 1,3,5-triallyl-1,3,5-triazine-2,4,6-trione (TATATO) as the ene derivative. Especially, after storage in water, the flexural strength and modulus of elasticity is twice as high compared to the PETMP reference system.