1745-89-7

Basic information

• Product Name: Diallyl bisphenol A
• Synonyms: 4,4'-(Propane-2,2-diyl)bis(2-allylphenol);2,2'-Diallylbisphenol A technical grade, 85%;4,4’-(1-methylethylidene)bis[2-(2-propenyl)-pheno;4,4’-(1-methylethylidene)bis[2-(2-propenyl)-Phenol;LABOTEST-BB LT00159294;2,2'-DIALLYLBISPHENOL A;4,4'-(1-METHYLETHYLIDENE)BIS(2-ALLYLPHENOL);ALLYL BISPHENOL A
• CAS NO: 1745-89-7
• Molecular Formula: C21H24O2
• Molecular Weight: 308.41
• EINECS: 217-121-1
• Product Categories: Allyl Monomers;Monomers;Polymer Science
• Mol File: 1745-89-7.mol
• Article Data: 22

Chemical Properties

• Boiling Point: 445.2 °C at 760 mmHg
• Flash Point: >230 °F
• Appearance: Light yellow or brown liquid
• Density: 1.08 g/mL at 25 °C(lit.)
• Vapor Pressure: 0Pa at 20℃
• Refractive Index: n20/D 1.587(lit.)
• Storage Temp.: 2-8°C
• PKA: 10.53±0.10(Predicted)
• Water Solubility: 31.1mg/L at 20℃
• CAS DataBase Reference: Diallyl bisphenol A(CAS DataBase Reference)
• NIST Chemistry Reference: Diallyl bisphenol A(1745-89-7)
• EPA Substance Registry System: Diallyl bisphenol A(1745-89-7)

Safety Data

• Hazard Codes: C
• Statements: 34-43
• Safety Statements: 23-26-27-36/37/39-45
• RIDADR: UN 1760 8/PG 3
• WGK Germany: 3
• HazardClass: 8
• PackingGroup: III
• Hazardous Substances Data: 1745-89-7(Hazardous Substances Data)

Usage

Appearance

Diallyl bisphenol A is light yellow or brown liquid

application

It is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the handling and processability of BMI resin. Improve the toughness, heat resistance and moldability of BMI resin. Can be used for: 1. electrical insulation materials, copper clad circuit boards, high temperature impregnating varnish, insulating varnish laminates, molded plastics, etc. 2. wear-resistant materials, diamond grinding wheel, heavy-duty grinding wheel, brake pads, high temperature bearing adhesives, etc. 3. aerospace structural materials. 4. functional materials. Anti-aging agent for rubber, adding 1-3% BBA to rubber can greatly improve the anti-aging process of rubber.

Storage Condition

Keep in a cool, dry, dark location in a tightly sealed container or cylinder. Keep away from incompatible materials, ignition sources and untrained individuals. Secure and label area. Protect containers/cylinders from physical damage.

Uses

diallyl bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., and it can enhance the toughness of thermosetting resin greatly. It also can be used as actively diluent of thermosetting resin. The adhesion strength between metal can be further improved when used in rubber.

General Description

2,2′-Diallylbisphenol A (DABA) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material. It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Upstream product

• 80-05-7 BPA 
• 106-95-6 allyl bromide 
• 3739-67-1 bisphenol A diallyl ether 
• 107-05-1 3-chloroprop-1-ene 
• 107-18-6 allyl alcohol 
• 591-87-7 Allyl acetate 
• 557-40-4 Allyl ether 
• 95-50-1 1,2-dichloro-benzene 

Downstream Products

• 26306-34-3 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether 
• 216433-39-5 6,6′-(propane-2,2-diyl)bis(8-allyl-3-phenyl-3,4-dihydro-2H-benzo[e][1,3]oxazine) 
• 1071466-61-9 propane-2,2-diylbis(2-allyl-4,1-phenylene)diacetate 
• 218772-85-1 2,2-bis[3-(3-mercaptopropyl)-4-(3-mercaptopropoxy)phenyl]-propane 
• 1636900-12-3 2,2-bis[3-(3-acetylmercaptopropyl)-4-(3-acetylmercaptopropoxy)-phenyl]propane 

Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

METHOD OF CONSISTENTLY PRODUCING DIALLYLBISPHENOLS

The purpose of the present invention is to provide a method of consistently producing high-quality diallylbisphenols with high yields from bisphenols. This method involves steps (1) through (3) below, and enables the consistent production of diallylbisphenols from bisphenols. (1) A step for reacting allyl halides and bisphenols or alkali metal salts thereof in a cellosolve solvent in the presence or absence of basic alkali metal salts, (2) a step for separating inorganic salt by-products from a reaction solution obtained in step (1), and (3) a step for heating and subjecting to a rearrangement reaction the reaction solution obtained in step (2).

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.