1745-89-7

Basic information

• Product Name: Diallyl bisphenol A
• Synonyms: 4,4'-(Propane-2,2-diyl)bis(2-allylphenol);2,2'-Diallylbisphenol A technical grade, 85%;4,4’-(1-methylethylidene)bis[2-(2-propenyl)-pheno;4,4’-(1-methylethylidene)bis[2-(2-propenyl)-Phenol;LABOTEST-BB LT00159294;2,2'-DIALLYLBISPHENOL A;4,4'-(1-METHYLETHYLIDENE)BIS(2-ALLYLPHENOL);ALLYL BISPHENOL A
• CAS NO: 1745-89-7
• Molecular Formula: C21H24O2
• Molecular Weight: 308.41
• EINECS: 217-121-1
• Product Categories: Allyl Monomers;Monomers;Polymer Science
• Mol File: 1745-89-7.mol
• Article Data: 22

Chemical Properties

• Boiling Point: 445.2 °C at 760 mmHg
• Flash Point: >230 °F
• Appearance: Light yellow or brown liquid
• Density: 1.08 g/mL at 25 °C(lit.)
• Vapor Pressure: 0Pa at 20℃
• Refractive Index: n20/D 1.587(lit.)
• Storage Temp.: 2-8°C
• PKA: 10.53±0.10(Predicted)
• Water Solubility: 31.1mg/L at 20℃
• CAS DataBase Reference: Diallyl bisphenol A(CAS DataBase Reference)
• NIST Chemistry Reference: Diallyl bisphenol A(1745-89-7)
• EPA Substance Registry System: Diallyl bisphenol A(1745-89-7)

Safety Data

• Hazard Codes: C
• Statements: 34-43
• Safety Statements: 23-26-27-36/37/39-45
• RIDADR: UN 1760 8/PG 3
• WGK Germany: 3
• HazardClass: 8
• PackingGroup: III
• Hazardous Substances Data: 1745-89-7(Hazardous Substances Data)

Usage

Appearance

Diallyl bisphenol A is light yellow or brown liquid

application

It is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the handling and processability of BMI resin. Improve the toughness, heat resistance and moldability of BMI resin. Can be used for: 1. electrical insulation materials, copper clad circuit boards, high temperature impregnating varnish, insulating varnish laminates, molded plastics, etc. 2. wear-resistant materials, diamond grinding wheel, heavy-duty grinding wheel, brake pads, high temperature bearing adhesives, etc. 3. aerospace structural materials. 4. functional materials. Anti-aging agent for rubber, adding 1-3% BBA to rubber can greatly improve the anti-aging process of rubber.

Storage Condition

Keep in a cool, dry, dark location in a tightly sealed container or cylinder. Keep away from incompatible materials, ignition sources and untrained individuals. Secure and label area. Protect containers/cylinders from physical damage.

Uses

diallyl bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., and it can enhance the toughness of thermosetting resin greatly. It also can be used as actively diluent of thermosetting resin. The adhesion strength between metal can be further improved when used in rubber.

General Description

2,2′-Diallylbisphenol A (DABA) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material. It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Upstream product

• 80-05-7 BPA 
• 557-40-4 Allyl ether 
• 591-87-7 Allyl acetate 
• 107-18-6 allyl alcohol 
• 107-05-1 3-chloroprop-1-ene 
• 106-95-6 allyl bromide 
• 95-50-1 1,2-dichloro-benzene 
• 3739-67-1 bisphenol A diallyl ether 

Downstream Products

• 126791-29-5 2,2'-bis(3-allyl-4-cyanatophenyl)isopropylidene 
• 85842-07-5 C₃₁H₄₂N₂O₂*2ClH 
• 216433-39-5 6,6′-(propane-2,2-diyl)bis(8-allyl-3-phenyl-3,4-dihydro-2H-benzo[e][1,3]oxazine) 
• 26306-34-3 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether 
• 1071466-61-9 propane-2,2-diylbis(2-allyl-4,1-phenylene)diacetate 
• 218772-85-1 2,2-bis[3-(3-mercaptopropyl)-4-(3-mercaptopropoxy)phenyl]-propane 
• 1636900-12-3 2,2-bis[3-(3-acetylmercaptopropyl)-4-(3-acetylmercaptopropoxy)-phenyl]propane 
• 145672-99-7 5,5’-(propane-2,2-diyl)bis(1,3-diallyl-2-(allyloxy)benzene) 

Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

Bisphenol-based epoxy compound using thiol-ene reaction and method for preparing the same, and composite of organic-inorganic materials comprising a cured product thereof and method for preparing the composite

The present invention relates to a bisphenol-based epoxy compound having an alkoxysilylalkyl-S-alkyl group and a method for preparing the same, a composite of organic-inorganic materials comprising the cured product and a method for preparing the composite. The novel bisphenol-based epoxy compound can provide a composite which shows improved thermal resistance and thermal expansion properties and has excellent hardness when being used for manufacturing high-integration and high-performance electronic components such as a next-generation semiconductor substrate and PCB.COPYRIGHT KIPO 2017

METHOD OF CONSISTENTLY PRODUCING DIALLYLBISPHENOLS

The purpose of the present invention is to provide a method of consistently producing high-quality diallylbisphenols with high yields from bisphenols. This method involves steps (1) through (3) below, and enables the consistent production of diallylbisphenols from bisphenols. (1) A step for reacting allyl halides and bisphenols or alkali metal salts thereof in a cellosolve solvent in the presence or absence of basic alkali metal salts, (2) a step for separating inorganic salt by-products from a reaction solution obtained in step (1), and (3) a step for heating and subjecting to a rearrangement reaction the reaction solution obtained in step (2).

ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS, COMPOSITION, CURED PRODUCT THEREOF, USE THEREOF AND PREPARING METHOD OF ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS

The present invention relates to an alkoxysilyl compound having two or more alkoxysilyl groups (hereinafter, referred to as ″alkoxysilyl compound″) showing an excellent heat-resistance in a composite, a composition and a cured product comprising the same, an use thereof, and a method for preparing the alkoxysilyl compound. The alkoxysilyl composition comprising the novel alkoxysilyl compound, according to the present invention, in a composite, shows improved heat-resistance, i.e., an effect of decreasing CTE of the alkoxysilyl composition, or an effect of increasing glass transition temperature or not showing glass transition temperature (hereinafter, referred to as ″Tg less″) by forming a chemical bond between the alkoxysilyl group and a filler (fibers and/or particles). Further, the cured product comprising the alkoxysilyl compound according to the present invention shows an excellent flame retardant property due to the alkoxysilyl group. Moreover, when the alkoxysilyl composition according to the present invention is applied to a metal film of a substrate, an excellent adhesion to the metal film is exhibited due to a chemical bond between a functional group on a surface of the metal film and the alkoxysilyl group.

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.

Investigations of thiol-modified phenol derivatives for the use in thiol-ene photopolymerizations

Thiol-ene photopolymerizations gain a growing interest in academic research. Coatings and dental restoratives are interesting applications for thiol-ene photopolymerizations due to their unique features. In most studies the relative flexible and hydrophilic ester derivative, namely pentaerythritoltetra(3-mercaptopropionate) (PETMP), is investigated as the thiol component. Thus, in the present study we are encouraged to investigate the performance of more hydrophobic ester-free thiol-modified bis-and trisphenol derivatives in thiol-ene photopolymerizations. For this, six different thiol-modified bis-and trisphenol derivatives exhibiting four to six thiol groups are synthesized via the radical addition of thioacetic acid to suitable allyl-modified precursors and subsequent hydrolysis. Compared to PETMP better flexural strength and modulus of elasticity are achievable in thiol-ene photopolymerizations employing 1,3,5-triallyl-1,3,5-triazine-2,4,6-trione (TATATO) as the ene derivative. Especially, after storage in water, the flexural strength and modulus of elasticity is twice as high compared to the PETMP reference system.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.

Highly stable self-crosslinked anion conductive ionomers for fuel cell applications

We report a simple method for the preparation of self-crosslinked anion conductive ionomers (SCL-ACIs) via polycondensation-Friedel-Crafts alkylation reactions without using any catalyst or crosslinking agent. The reported alkaline stable and methanol impervious SCL-ACIs with 2.45 mequiv. g -1 ion-exchange capacity (IEC) and 68 mS cm-1 hydroxide ion conductivity were assessed as suitable candidates for alkaline direct methanol fuel cell (ADMFC) applications. the Partner Organisations 2014.

Selective O-allylation of bisphenol A: Toward a chloride-free route for epoxy resins

The O-allylation of bisphenol A (BPA) has been performed with the most selective catalysts for O-allylation of phenols reported previously. Both the cyclopentadienyl-ruthenium catalysts and the palladium-diphosphine catalysts are capable of selectively performing single and double O-allylation of BPA. An intriguing solvent effect is observed; the choice of the solvent is of key importance for both conversion and selectivity. The use of an excess of diallyl ether as allylating agent results in relatively high yields of the bisallyl ether of bisphenol A, while maintaining the high selectivity for O-allylation.