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1785-64-4

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  • 5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene

    Cas No: 1785-64-4

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  • 5 Kiloliter

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1785-64-4 Usage

Description

Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.

Physical properties

TYPICAL PROPERTIES OF DEPOSITED PARYLENE F FILMGas Permeability, O2: 16.7 (cc*mm)/(m2*day*atm)Short Term Service Temperature: 250℃Continuous Service Temperature: 200℃Coefficient of Friction (Static and Dynamic): 0.35Rockwell Hardness: R80Tensile Strength: 7,800 psiPenetration Power: 30 XDielectric Strength @ 1 mil: 7.0 KVUSP Class VI Polymer: Yes

Uses

Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation

benefits

Parylene F film meets all requirements of MIL-I-46058C, IPC-CC-830B and NASA-STD-8739.1 as type XYUSP Class VI biocompatibilityUL-94 V-0 flammability ratingNo VOC's or solvents used in deposition processRoHS and REACH compliantVapor deposition has a high penetration power and is extremely conformalDeposition occurs in a vacuum chamber occurs at room temperature and does not exert any force during depositionNo curing cycleExcellent barrier and dielectric propertiesChemically and biologically inertExtremely thin and lightweight coatingNo outgassing, approved by NASA HydrophobicAble to sterilize with all common sterilization methods

storage

Store in a cool, dark place in the original unopened container when not in use. Do not place in view of UV light source including sunlight. Dimer is not known to degrade when stored out of direct sunlight and below 30°C. Recommend retesting after five years from manufacturer date.

Check Digit Verification of cas no

The CAS Registry Mumber 1785-64-4 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 1,7,8 and 5 respectively; the second part has 2 digits, 6 and 4 respectively.
Calculate Digit Verification of CAS Registry Number 1785-64:
(6*1)+(5*7)+(4*8)+(3*5)+(2*6)+(1*4)=104
104 % 10 = 4
So 1785-64-4 is a valid CAS Registry Number.

1785-64-4SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 11, 2017

Revision Date: Aug 11, 2017

1.Identification

1.1 GHS Product identifier

Product name Dimer,Parylene F

1.2 Other means of identification

Product number -
Other names Parylene F

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:1785-64-4 SDS

1785-64-4Downstream Products

1785-64-4Relevant articles and documents

Preparation method of parylene

-

Paragraph 0067-0069; 0072-0073, (2021/04/03)

The invention discloses a preparation method of parylene. The method comprises the steps: carrying out a reaction on a compound 1A to obtain a compound 2A; and reacting the compound 2A with a compound2B to obtain a parylene crude product, and purifying the parylene crude product to obtain a parylene fine product. According to the method, the reagent with lower price is used as a starting raw material, the final product is obtained through two-step reaction, the reaction condition of each step is mild, the yield of the obtained parylene is high, and the cost can be greatly reduced.

Method for using microchannel reactor to prepare paracyclophane monomeric compound

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Paragraph 0070; 0074-0077, (2017/08/23)

The invention discloses a method for using a microchannel reactor to prepare a paracyclophane monomeric compound. The method comprises the steps of preheating, intermediate synthesizing, product synthesizing, oil-water separating, purifying and the like. The paracyclophane monomeric compound is prepared in the continuous microchannel reactor. The method for using the microchannel reactor to prepare the paracyclophane monomeric compound has the advantages of being low in cost and small in energy consumption, having less three wastes, having continuous controllability, having no amplification effect and the like, and is capable of being subjected to simple amplification with equal ratio according to a demand of practical production.

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