18057-66-4Relevant academic research and scientific papers
Di- and tetracarboxylic aromatic acids with silane spacers and their copper complexes: Synthesis, structural characterization and properties evaluation
Cazacu, Maria,Vlad, Angelica,Zaltariov, Mirela-Fernanda,Shova, Sergiu,Novitchi, Ghenadie,Train, Cyrille
, p. 70 - 78 (2014)
Two polycarboxylic acids, bis(p-carboxyphenyl)diphenylsilane and bis(3,4-dicarboxyphenyl)dimethylsilane, were prepared according to published procedures and characterized, besides elemental and spectral analysis, for the first time by X-ray single crystal
Silicon-containing oligomeric poly(imido-amides) with amino moieties. Synthesis, characterization and thermal studies
Tagle, Luis H.,Terraza, Claudio A.,Tundidor-Camba, Alain,Ortiz, Pablo A.
, p. 30197 - 30210 (2014/08/05)
Silicon-containing oligomeric poly(imido-amides) (PIAs) were synthesized from dicarboxylic imido-acids containing a Si atom, which were obtained from dianhydrides and the amino acids glycine, l-alanine, l-phenylalanine, l-valine, l-leucine, l-isoleucine a
Di- and tetracarboxylic aromatic acids with silane spacers and their copper complexes: Synthesis, structural characterization and properties evaluation
Cazacu, Maria,Vlad, Angelica,Zaltariov, Mirela-Fernanda,Shova, Sergiu,Novitchi, Ghenadie,Train, Cyrille
supporting information, p. 70 - 78 (2014/12/11)
Two polycarboxylic acids, bis(p-carboxyphenyl)diphenylsilane and bis(3,4-dicarboxyphenyl)dimethylsilane, were prepared according to published procedures and characterized, besides elemental and spectral analysis, for the first time by X-ray single crystal
Synthesis and properties of new poly(imide-amide)s
Sava, Ion,Bruma, Maria
, p. 791 - 798 (2007/10/03)
New aromatic poly(imide-amide)s have been synthesized by solution polycondensation of various aromatic diamines with diacid chlorides containing dimethylsillane or hexafluoroisopropylidene units. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature above 400°C and glass transition temperature in the range of 265-324°C. Very thin polymer films deposited by the spin-coating technique onto silicon wafers showed a smooth, pinhole-free surface in Atomic Force Microscopy investigations.
