634585-35-6

Upstream product

• 42297-18-7 bis(3,4-dicarboxyphenyl)dimethylsilane dianhydride 
• 150-13-0 4-amino-benzoic acid 
• 18057-66-4 bis(3,4-dimethylphenyl)dimethylsilane 
• 583-71-1 4-bromo-o-xylene 
• 42297-17-6 4,4'-(dimethylsilanediyl)diphthalic acid 

Downstream Products

• 634585-36-7 bis[N-(4-chlorocarbonylphenyl)phthalimid-5-yl]-dimethylsilane 

Relevant academic research and scientific papers

Hydrogen-bonded supramolecular polymers containing dimethylsilane groups: Synthesis, crystal structure, and characterization

Bis[N-(4-carboxyphenyl)phtalimidyl]dimethylsilane prepared by the reaction between bis(3,4-dicarboxyphenyl)dimethylsilane anhydride and p-aminobenzoic acid has been used to built three novel hydrogen-bonded supramolecular polymers as a result of cocrystal

Blue light-emitting polyamide and poly(amide-imide)s containing 1,3,4-oxadiazole ring in the side chain

A new diamine monomer containing a 1,3,4-oxadiazole ring, 4,4′-diamino-4″-[2-(4-phenoxy)-5-(4-dimethylaminophenyl)-1,3,4-oxadiazole]triphenylmethane, was synthesized and characterized. The diamine is used to prepare novel polyamide and poly(amide-imide)s

Silicon-containing oligomeric poly(imido-amides) with amino moieties. Synthesis, characterization and thermal studies

Silicon-containing oligomeric poly(imido-amides) (PIAs) were synthesized from dicarboxylic imido-acids containing a Si atom, which were obtained from dianhydrides and the amino acids glycine, l-alanine, l-phenylalanine, l-valine, l-leucine, l-isoleucine a

Silicon-containing aromatic poly(amide-imide)s

Silicon-containing poly(amide-imide)s have been synthesized by polycondensation reaction of various aromatic diamines with a dicarboxylic acid or a diacid dichloride containing the dimethylsilylene group and preformed imide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show medium to high average molecular weights, high thermal stability, with initial decomposition temperature being above 400°C and glass transition temperature in the range of 220-280°C.

Synthesis and properties of new poly(imide-amide)s

New aromatic poly(imide-amide)s have been synthesized by solution polycondensation of various aromatic diamines with diacid chlorides containing dimethylsillane or hexafluoroisopropylidene units. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature above 400°C and glass transition temperature in the range of 265-324°C. Very thin polymer films deposited by the spin-coating technique onto silicon wafers showed a smooth, pinhole-free surface in Atomic Force Microscopy investigations.