18190-63-1

Basic information

• Product Name: 1,3-Benzenedicarboxylic acid, 2,4-dimethyl-
• Synonyms: 2,4-Dimethyl-isophthalsaeure;2,4-Dimethylbenzol-1,3-dicarbonsaeure;2,4-dimethyl-isophthalic acid
• CAS NO: 18190-63-1
• Molecular Formula: C10H10O4
• Molecular Weight: 194.187
• Mol File: 18190-63-1.mol
• Article Data: 1

Chemical Properties

• CAS DataBase Reference: 1,3-Benzenedicarboxylic acid, 2,4-dimethyl-(CAS DataBase Reference)
• NIST Chemistry Reference: 1,3-Benzenedicarboxylic acid, 2,4-dimethyl-(18190-63-1)
• EPA Substance Registry System: 1,3-Benzenedicarboxylic acid, 2,4-dimethyl-(18190-63-1)

Safety Data

• Hazardous Substances Data: 18190-63-1(Hazardous Substances Data)

Usage

Usage

a. Manufacturing of polyester resins and fibers
b. Production of plasticizers
c. Various other industrial applications

Hazard level

Low hazard chemical

Health risk

Limited evidence of being harmful to human health

Safety precautions

Handle and use with caution, following safety guidelines to prevent potential risks.

Upstream product

• 2529-36-4 2,3,6-trimethylbenzoic acid 
• 527-53-7 1,2,3,5-Tetramethylbenzene 
• 7697-37-2 nitric acid 

Downstream Products

• 89-32-7 Pyromellitic dianhydride 
• 528-44-9 1,2,4-benzene tricarboxylic acid 
• 552-30-7 trimellitic Anhydride 

Relevant articles and documents

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.