22428-30-4

Usage

Uses

Used in Epoxy Resin Industry:
3,3'-Dihydroxy-4,4'-diaminodiphenylmethane is used as a curing agent for the production of epoxy resins, contributing to the formation of strong, heat-resistant, and chemically resistant materials. Its role in the curing process enhances the adhesive properties and durability of the final product, making it a popular choice in this industry.
Used in Adhesive Manufacturing:
In the adhesive manufacturing industry, 3,3'-Dihydroxy-4,4'-diaminodiphenylmethane is utilized for its excellent bonding capabilities. It serves as a key component in formulating adhesives that offer high strength and resistance to environmental factors, ensuring robust and long-lasting bonds in various applications.
Used in Coating Production:
3,3'-Dihydroxy-4,4'-diaminodiphenylmethane is employed as a component in coating formulations to improve their performance characteristics. Its inclusion in coatings results in products with enhanced durability, heat resistance, and chemical stability, which are essential for protecting surfaces in demanding environments.
Used in Electrical Insulator Manufacturing:
3,3'-Dihydroxy-4,4'-diaminodiphenylmethane is also used in the manufacturing of electrical insulators. The high resistance to heat and chemicals, along with its insulating properties, makes 3,3'-Dihydroxy-4,4'-diaminodiphenylmethane a valuable ingredient in creating insulators that can withstand harsh conditions and provide reliable performance in electrical systems.

Upstream product

• 50-00-0 formaldehyd 
• 95-55-6 2-amino-phenol 
• 1223-20-7 4-(4-amino-3-methoxybenzyl)-2-methoxyaniline 

Relevant academic research and scientific papers

SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND

Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubst

Heat Resistance and Electrophysical Characteristics of Polyheteroarylenes and Ferroelectric–Polymer Film Composites Based on Them

Abstract: Structurally related poly(amido-o-hydroxy amides) derived from 5,5-methylenebis(2-aminophenol) with tetramethylsiloxane and heteroaromatic (benzoxazole and benzotriazole) fragments incorporated in the second amine component or formed by polyheterocyclization of the corresponding prepolymers were prepared. The effect of modifying fragments introduced into the base poly(o-hydroxy amide) on the heat resistance of powders and films and of films of photosensitive compounds based on the synthesized polymers with the naphthoquinone diazide component was analyzed. The electrophysical parameters of the polymer films and film composites with a nanodispersed ferroelectric filler, (PZT: ceramic powder with the composition Pb0.81Sr0.04Na0.075Bi0.075(Zr0.58 Ti0.42)O3, Russian brand PZT-1), prepared on the basis of modified polymer binders, were determined. Introduction of 20 mol % sulfur-containing fragments into the polymer binder ensures a 50–65?C increase in the heat resistance for all types of films without increasing the level of the dielectric loss for the composite coatings.

Composition, cured product and laminate

The present invention addresses the problem of providing a composition that has excellent heat resistance and excellent adhesiveness. The present invention also addresses the problem of providing: a cured product which is obtained by curing this composition; and a laminate which contains this cured product. The present invention also addresses the problem of providing a heat-resistant material, a heat-resistant member, an electronic material and an electronic member, each of which contains this composition. The above-mentioned problems are solved by providing a composition that contains: a (meth)allyl group-containing maleimide compound which is characterized by having a structure that has one or more benzene rings and by having one or more groups each having a (meth)allyl group and one or more groups each having a maleimide group; and a hydroxyl group-containing maleimide compound which is characterized by having a structure that has one or more benzene rings and by having one or more groups each having a hydroxyl group and one or more maleimide groups.

Oxazine compound, composition and cured product

An oxazine compound with a specific structure is provided, characterized by having a group that has an aromatic ring structure and multiple specified carbon-carbon triple bond structures. Further, a composition including the oxazine compound having the sp