253679-51-5Relevant articles and documents
Oxalic amide ligands, and uses thereof in copper-catalyzed coupling reaction of aryl halides
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Page/Page column 98, (2020/01/09)
The present invention provides oxalic amide ligands and uses thereof in copper-catalyzed coupling reaction of aryl halides. Specifically, the present invention provides a use of a compound represented by formula I, wherein definitions of each group are described in the specification. The compound represented by formula I can be used as a ligand in copper-catalyzed coupling reaction of aryl halides for the formation of C—N, C—O and C—S bonds.