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3,5-dihydroxybenzene-1,2-dicarboxylic acid, also known as resorcin[4,5-d]isoxazole-3,6-dicarboxylic acid or phthalic acid, is an organic compound with the chemical formula C8H6O6. It is a white crystalline solid that is soluble in water and has a melting point of 230-235°C. 3,5-dihydroxybenzene-1,2-dicarboxylic acid is an important intermediate in the synthesis of various pharmaceuticals, dyes, and other chemicals. It is produced industrially through the oxidation of resorcinol with potassium permanganate or other oxidizing agents. Due to its versatile chemical properties, it is widely used in the manufacturing of plastics, resins, and other polymers.

3209-07-2

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3209-07-2 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 3209-07-2 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 3,2,0 and 9 respectively; the second part has 2 digits, 0 and 7 respectively.
Calculate Digit Verification of CAS Registry Number 3209-07:
(6*3)+(5*2)+(4*0)+(3*9)+(2*0)+(1*7)=62
62 % 10 = 2
So 3209-07-2 is a valid CAS Registry Number.

3209-07-2SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 18, 2017

Revision Date: Aug 18, 2017

1.Identification

1.1 GHS Product identifier

Product name 3,5-dihydroxyphthalic acid

1.2 Other means of identification

Product number -
Other names 3,5-dihydroxy-phthalic acid

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:3209-07-2 SDS

3209-07-2Relevant academic research and scientific papers

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

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, (2014/03/21)

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

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