4098-97-9

Basic information

• Product Name: Trisilane, 1,1,2,2,3,3-hexamethyl-1,3-diphenyl-
• CAS NO: 4098-97-9
• Molecular Formula: C18H28Si3
• Molecular Weight: 328.677
• Mol File: 4098-97-9.mol
• Article Data: 9

Chemical Properties

• CAS DataBase Reference: Trisilane, 1,1,2,2,3,3-hexamethyl-1,3-diphenyl-(CAS DataBase Reference)
• NIST Chemistry Reference: Trisilane, 1,1,2,2,3,3-hexamethyl-1,3-diphenyl-(4098-97-9)
• EPA Substance Registry System: Trisilane, 1,1,2,2,3,3-hexamethyl-1,3-diphenyl-(4098-97-9)

Safety Data

• Hazardous Substances Data: 4098-97-9(Hazardous Substances Data)

Upstream product

• 4342-61-4 1,2-dichlorotetramethylsilane 
• 768-33-2 phenyldimethylsilyl chloride 
• 1145-98-8 1,2-diphenyltetramethyldisilane 
• 3839-31-4 dimethyl(phenyl)silyllithium 
• 56-33-7 1,1,3,3-tetramethyl-1,3-diphenyldisiloxane 
• 75-78-5 dimethylsilicon dichloride 
• 941-15-1 1-chloro-2-phenyltetramethyldisilane 

Downstream Products

• 31732-54-4 triethyldimethyldisilane 
• 1145-98-8 1,2-diphenyltetramethyldisilane 
• 10536-53-5 1,5-diphenyldecamethylpentasilane 
• 1379575-44-6 C₁₉H₃₀SSi₃ 
• 1379575-53-7 1,5-bis(4-(methylthio)phenyl)decamethylpentasilane 
• 1363159-09-4 1,3-bis(4-(methylthio)phenyl)hexamethyltrisilane 
• 812-36-2 1,3-dichloro-1,1,2,2,3,3-hexamethyltrisilane 
• 138488-60-5 1-chloro-1,1,2,2,3,3-hexamethyl-3-phenyltrisilane 
• 136246-83-8 2,4,4,6-tetramethyl-2,6-diphenyl-3,5-bis(2,6-xylylimino)-2,4,6-trisilaheptane 
• 136213-26-8 2,4,4,5-tetramethyl-2,5-diphenyl-3-(2,6-xylylimino)-2,4,5-trisilahexane 

Relevant articles and documents

Silane bridging luminescent material, preparation method and application thereof, and color developing agent

The invention relates to the technical field of detection, and discloses a silane bridging luminescent material, a preparation method and an application thereof, and a color developing agent, the silane bridging luminescent material has a structure repres

Conductive molecular silicon

Bulk silicon, the bedrock of information technology, consists of the deceptively simple electronic structure of just Si-Si σ bonds. Diamond has the same lattice structure as silicon, yet the two materials have dramatically different electronic properties. Here we report the specific synthesis and electrical characterization of a class of molecules, oligosilanes, that contain strongly interacting Si-Si σ bonds, the essential components of the bulk semiconductor. We used the scanning tunneling microscope-based break-junction technique to compare the single-molecule conductance of these oligosilanes to those of alkanes. We found that the molecular conductance decreases exponentially with increasing chain length with a decay constant β = 0.27 ± 0.01 A-1, comparable to that of a conjugated chain of C = C π bonds. This result demonstrates the profound implications of σ conjugation for the conductivity of silicon.

Polymeric organosilicon systems. XXIX. Thermal properties of poly[(disilanylene)oligophenylenes]

Thermal properties of variously substituted poly[(disilanylene)oligophenylenes], [(SiR1R2SiR1R2)(p-C6H4)m]n (R1=R2=Me, R1=R2=Et, and R1=Ph, R2=Me, m=1-4) were investigated. The thermogravimetric analysis of the polymers in the range of 20-1000°C showed rapid weight loss starting from about 400°C. The total weight loss of the polymers at 1000°C was calculated to be 54.5-75.5% based on the initial weight of the polymers. GC-MS analysis of the volatile products obtained from the pyrolysis of the polymers with R1=R2=Me, m=2 and R1=R2=Et, m=1-4 at 500°C indicated the formation of silicon-containing oligomers arising from the Si-Si and Si-phenylene bond cleavage, mainly. The formation of oligophenylenes, H(C6H4)lH (l=1-4), was also observed in the pyrolysis of the polymers with m=3 and 4. A model reaction for the polymer degradation was also examined, using 1,2-diphenyltetramethyldisilane.