5167-76-0Relevant academic research and scientific papers
Tenacic Acids: A New Class of Tenacious Binders to Metal Oxide Surfaces
Komati, Rajesh,Mitchell, Carl A.,LeBeaud, Anastasia,Do, Huy,Goloverda, Galina Z.,Kolesnichenko, Vladimir L.
supporting information, p. 14824 - 14829 (2018/09/12)
The backbone of 2-hydroxyisophthalic acid was identified as a potential metal oxide anchor because of the perfect alignment of all three of its donor groups for binding to inorganic surfaces. It can therefore be used in the design of organic linkers for m
2-HYDROXYISOPHTHALIC ACID AND ITS DERIVATIVES: METHODS OF MAKING AND APPLICATIONS
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Paragraph 0027; 0040; 0057; 0060, (2018/04/12)
Substituted derivatives of 2-hydroxyisophthalic acid are provided, as well as new synthetic routes for making 2-hydroxyisophthalic acid and the substituted derivatives. Potential uses of the derivatives in a variety of applications are also provided.
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
