5293-56-1

Usage

Chemical structure

1,3-Benzenedicarboxylic acid, 2-butyl

Physical state

Colorless, oily liquid

Boiling point

Relatively high

Uses

a. Plasticizer in products like nail polish, adhesives, and cellulose plastics
b. Found in some personal care products (perfumes and lotions)

Health risks

a. Endocrine disruption
b. Reproductive toxicity

Regulatory status

a. Restricted use in some countries
b. Listed as a substance of very high concern by the European Chemicals Agency

Ongoing efforts

Finding safer alternatives to DBP in consumer products

Upstream product

• 109-72-8 n-butyllithium 
• 124-38-9 carbon dioxide 
• 4170-72-3 tert-butyl-phenyl sulfone 
• 80-18-2 Methyl benzenesulfonate 
• 62261-17-0 tert-butyl 2,6-dibromophenyl sulfone 
• 608-30-0 2,6-dibromoaniline 
• 64682-37-7 1,3-bis(4,4-dimethyl-2-oxazoline-2-yl)benzene 
• 99-63-8 benzene-1,3-dicarbonyl dichloride 
• 64682-39-9 4,4,4',4'-tetramethyl-4,5,4',5'-tetrahydro-2,2'-(2-methyl-m-phenylene)-bis-oxazole 
• 62261-15-8 2,6-dibromo-1-(tert-butylthio)benzene 
• 62261-14-7 2,6-dibromobenzenethiol 

Downstream Products

• 247942-84-3 Di(tert-butyl) 5-(3-methyl-3-hydroxy-1-butynyl)-2-butylbenzene-1,3-dicarboxylate 
• 247942-83-2 5-Bromo-2-butylbenzene-1,3-dicarbonylchloride 
• 247942-87-6 Bis(4-butyl-3,5-di(tert-butoxycarbonyl)phenyl)acetylene 
• 247942-85-4 Di(tert-butyl) 5-ethynyl-2-butylbenzene-1,3-dicarboxylate 
• 174619-28-4 Di(tert-butyl) 5-bromo-2-butylbenzene-1,3-dicarboxylate 
• 247942-82-1 5-Bromo-2-butylbenzene-1,3-dicarboxylic acid 
• 64682-44-6 2,6-Bis(hydroxymethyl)-n-butylbenzol 

Relevant academic research and scientific papers

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.