78114-07-5 Usage
Description
2,6-diethylbenzoic acid is a chemical compound with the molecular formula C6H4(C2H5)2COOH, which is a derivative of benzoic acid featuring two ethyl groups attached to the 2 and 6 positions of the benzene ring. This white, crystalline solid is recognized for its mild, non-hazardous nature, making it a valuable chemical in various industries.
Uses
Used in Pharmaceutical Industry:
2,6-diethylbenzoic acid is used as an intermediate in the synthesis of various pharmaceuticals due to its versatile chemical structure, which can be modified to create a range of medicinal compounds.
Used in Dye Industry:
2,6-diethylbenzoic acid is used as a building block in the production of dyes, where its chemical properties contribute to the color and stability of the final products.
Used in Fragrance Industry:
2,6-diethylbenzoic acid is used as a component in the creation of fragrances, leveraging its ability to contribute to the scent profiles of various products.
Used in Organic Synthesis:
2,6-diethylbenzoic acid is used as a building block in organic synthesis, allowing for the development of a wide array of chemical compounds for different applications.
Used in Polymer Industry:
2,6-diethylbenzoic acid is used as an intermediate in the manufacture of certain polymers, where its structural properties can influence the polymer's characteristics such as strength, flexibility, and durability.
Check Digit Verification of cas no
The CAS Registry Mumber 78114-07-5 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 7,8,1,1 and 4 respectively; the second part has 2 digits, 0 and 7 respectively.
Calculate Digit Verification of CAS Registry Number 78114-07:
(7*7)+(6*8)+(5*1)+(4*1)+(3*4)+(2*0)+(1*7)=125
125 % 10 = 5
So 78114-07-5 is a valid CAS Registry Number.
78114-07-5Relevant articles and documents
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
