78114-07-5

Usage

Uses

Used in Pharmaceutical Industry:
2,6-diethylbenzoic acid is used as an intermediate in the synthesis of various pharmaceuticals due to its versatile chemical structure, which can be modified to create a range of medicinal compounds.
Used in Dye Industry:
2,6-diethylbenzoic acid is used as a building block in the production of dyes, where its chemical properties contribute to the color and stability of the final products.
Used in Fragrance Industry:
2,6-diethylbenzoic acid is used as a component in the creation of fragrances, leveraging its ability to contribute to the scent profiles of various products.
Used in Organic Synthesis:
2,6-diethylbenzoic acid is used as a building block in organic synthesis, allowing for the development of a wide array of chemical compounds for different applications.
Used in Polymer Industry:
2,6-diethylbenzoic acid is used as an intermediate in the manufacture of certain polymers, where its structural properties can influence the polymer's characteristics such as strength, flexibility, and durability.

Upstream product

• 124-38-9 carbon dioxide 
• 92015-10-6 1,3-diethyl-2-iodobenzene 
• 65232-57-7 1,3-diethyl-2-bromobenzene 
• 6575-14-0 2,6-diethylbenzonitrile 
• 579-66-8 2,6-diethylaniline 
• 89151-70-2 2,6-Diethyl-benzamid 

Downstream Products

• 97079-59-9 Benzal-2,6-diethyl-acetophenon 
• 91495-60-2 1-Ethyl-2,3-diacetyl-benzol 
• 2040-02-0 2,6-diethylacetophenone 
• 97115-88-3 2,2',6,6'-Tetraethylbenzil 
• 91962-96-8 1,2,3-Triacetylbenzol 
• 22679-62-5 (+/-)-2.6-Diaethyl-benzhydrol 
• 92300-65-7 2,6-Diethyl-phenyl-essigsaeure-ethylester 
• 100256-33-5 2-(2,6-diethylphenyl)acetic acid 
• 22679-46-5 2,2',6,6'-Tetraethyl-benzophenon 
• 94959-59-8 (2,6-Diaethyl-phenyl)-malonsaeure-diaethylester 
• 94384-77-7 2,6,2'-Triethyl-benzophenon 
• 22679-44-3 2,6-Diethyl-benzophenon 
• 94968-84-0 2,6,2',6'-Tetraethyl-benzhydrylchlorid 
• 21945-81-3 2.2'.6.6'-Tetraaethyl-benzhydrol 

Relevant academic research and scientific papers

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Structural and Solvent Effects upon Decarboxylation of 2,6-Disubstituted Benzoyloxyl Radicals. A Laser Flash Photolysis Study of Bis(2,6-disubstituted-benzoyl) Peroxides

The rate constants for decarboxylation of 2,6-dimethylbenzoyloxyl, 2,4,6-trimethylbenzoyloxyl and 2,6-dichlorobenzoyloxyl radicals are larger than those of benzoyloxyl, 4-methylbenzoyloxyl and 2-chlorobenzoyloxyl radicals, respectively, in carbon tetrachloride and acetonitrile; however, the values in the former solvent are significantly larger than those in the latter.The rate acceleration with the ortho substituents is ascribed to a nonplanar geometry of the radicals brought about by twisting of the carbonyloxyl group due to a steric effect of the substituents.The polar solvent serves to stabilize a twisted charge-transfer structure of the radicals and retards their decarboxylation.