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81-21-0

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81-21-0 Usage

Uses

Dicyclopentadiene diepoxide acts as an intermediate for epoxy resins, plasticizers and protective coatings. It finds application as a rubber additive and adhesives, which is used at high temperature. Further, it is used in the preparation of endo-3-hydroxy-exo-9-oxa-exo-tetracyclo[5.3.1.02,6.08,10]undecane using lithium aluminum hydride as a reagent.

Safety Profile

Poison by ingestion andintravenous routes. Mildly toxic by skin contact. A skinirritant. When heated to decomposition it emits acridsmoke and irritating fumes.

Check Digit Verification of cas no

The CAS Registry Mumber 81-21-0 includes 5 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 2 digits, 8 and 1 respectively; the second part has 2 digits, 2 and 1 respectively.
Calculate Digit Verification of CAS Registry Number 81-21:
(4*8)+(3*1)+(2*2)+(1*1)=40
40 % 10 = 0
So 81-21-0 is a valid CAS Registry Number.
InChI:InChI=1/C10H12O2/c1-4-3-2-6-10(11-6)7(3)5(1)9-8(4)12-9/h3-10H,1-2H2

81-21-0 Well-known Company Product Price

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  • Alfa Aesar

  • (L02940)  Dicyclopentadiene diepoxide, 99%   

  • 81-21-0

  • 5g

  • 565.0CNY

  • Detail
  • Alfa Aesar

  • (L02940)  Dicyclopentadiene diepoxide, 99%   

  • 81-21-0

  • 25g

  • 2369.0CNY

  • Detail

81-21-0SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 17, 2017

Revision Date: Aug 17, 2017

1.Identification

1.1 GHS Product identifier

Product name Dicyclopentadiene diepoxide

1.2 Other means of identification

Product number -
Other names 1,2,5,6-Diepoxy-octahydro-4,7-methano-inden

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:81-21-0 SDS

81-21-0Relevant articles and documents

Synthesis of new azapolycyclic scaffolds via the domino aminolysis of dicyclopentadiene diepoxide in water

Palchykov, Vitalii A.,Gaponova, Rita G.,Omelchenko, Iryna V.,Kasyan, Liliya I.

supporting information, (2020/06/17)

A convenient method is reported for the multigram scale synthesis of compounds containing the novel octahydro-1H-2,5-epimino-4,7-methanoindene azapolycyclic system in good yields. This method involves the domino aminolysis of readily available dicyclopentadiene diepoxide in water at 165 °C. 2D NMR and XRD spectra of the products were studied in detail.

Preparation method of dicyclopentadiene dioxide based on modified nano aluminum oxide loaded heteropolyacid type compound catalyst

-

Paragraph 0033-0046, (2020/05/14)

The invention discloses a method for preparing dicyclopentadiene dioxide by catalytic oxidation of dicyclopentadiene serving as a raw material in the presence of a solvent through a suspended bed or afixed bed reactor by taking a modified nano aluminum oxide loaded heteropolyacid type compound as a catalyst and hydrogen peroxide as an oxidant. Compared with the prior art, the preparation method provided by the invention has the advantages that the catalyst is long in service life, stable in performance, simple to separate and high in product yield, and the reaction yield of dicyclopentadienedioxide is greater than 96%.

COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE

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Paragraph 0158-0160, (2020/11/30)

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

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