81-21-0Relevant articles and documents
Synthesis of new azapolycyclic scaffolds via the domino aminolysis of dicyclopentadiene diepoxide in water
Palchykov, Vitalii A.,Gaponova, Rita G.,Omelchenko, Iryna V.,Kasyan, Liliya I.
supporting information, (2020/06/17)
A convenient method is reported for the multigram scale synthesis of compounds containing the novel octahydro-1H-2,5-epimino-4,7-methanoindene azapolycyclic system in good yields. This method involves the domino aminolysis of readily available dicyclopentadiene diepoxide in water at 165 °C. 2D NMR and XRD spectra of the products were studied in detail.
Preparation method of dicyclopentadiene dioxide based on modified nano aluminum oxide loaded heteropolyacid type compound catalyst
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Paragraph 0033-0046, (2020/05/14)
The invention discloses a method for preparing dicyclopentadiene dioxide by catalytic oxidation of dicyclopentadiene serving as a raw material in the presence of a solvent through a suspended bed or afixed bed reactor by taking a modified nano aluminum oxide loaded heteropolyacid type compound as a catalyst and hydrogen peroxide as an oxidant. Compared with the prior art, the preparation method provided by the invention has the advantages that the catalyst is long in service life, stable in performance, simple to separate and high in product yield, and the reaction yield of dicyclopentadienedioxide is greater than 96%.
COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
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Paragraph 0158-0160, (2020/11/30)
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).