82784-82-5

Basic information

• Product Name: 3,4-dihydroxyphthalic acid
• Synonyms: 3,4-dihydroxyphthalic acid
• CAS NO: 82784-82-5
• Molecular Formula: C₈H₆O₆
• Molecular Weight: 0
• Mol File: 82784-82-5.mol
• Article Data: 1

Chemical Properties

• Boiling Point: 487.2°C at 760 mmHg
• Flash Point: 262.6°C
• Appearance: /
• Density: 1.779g/cm³
• Vapor Pressure: 2.63E-10mmHg at 25°C
• Refractive Index: 1.717
• CAS DataBase Reference: 3,4-dihydroxyphthalic acid(CAS DataBase Reference)
• NIST Chemistry Reference: 3,4-dihydroxyphthalic acid(82784-82-5)
• EPA Substance Registry System: 3,4-dihydroxyphthalic acid(82784-82-5)

Safety Data

• Hazardous Substances Data: 82784-82-5(Hazardous Substances Data)

Usage

InChI:InChI=1/C8H6O6/c9-4-2-1-3(7(11)12)5(6(4)10)8(13)14/h1-2,9-10H,(H,11,12)(H,13,14)

Upstream product

• 7732-18-5 water 
• 4733-50-0 2,3-dicyano-1,4-hydroquinone 
• 518-90-1 3,4-dimethoxy-phthalic acid 

Downstream Products

• 116314-76-2 3,4-dihydroxy-phthalic acid-anhydride 

Relevant articles and documents

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.